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Effect of substrate properties on isothermal fatigue of aerosol jet printed nano-Ag traces on flex

Published online by Cambridge University Press:  19 July 2019

Roshan Muralidharan ,
Arun Raj ,
Rajesh Sharma Sivasubramony ,
Manu Yadav ,
Mohammed Alhendi ,
Matthew Nilsson ,
Christopher Greene ,
Mark D. Poliks  and
Peter Borgesen
Roshan Muralidharan
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Arun Raj
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Rajesh Sharma Sivasubramony
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Manu Yadav
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Mohammed Alhendi
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Matthew Nilsson
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Christopher Greene
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Mark D. Poliks
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
Peter Borgesen*
Affiliation:
System Science and Industrial Engineering, Binghamton University, Binghamton, New York 13902, USA
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Sintered nanoparticle structures are macroscopically brittle but quite robust if deposited on a flexible substrate. The effects of a polymer substrate on the stretchability of both brittle and ductile coatings and traces are well established. Systematic effects of substrate properties on the fatigue resistance of aerosol printed nano-Ag are slightly more complex. The present work is focused on the early stages of fatigue, where the resistance increases significantly but cracks are not yet visible. Overall, the fatigue behavior is seen to vary with the combination of substrate modulus and viscoelastic deformation properties. Comparing two common polyimides, the rate of damage was seen to increase faster with increasing amplitude on the less compliant one. Consistently with this increasing the minimum strain in the cycle led to a significantly stronger reduction in damage rates. However, the damage rate remained lower on the less compliant substrate at all amplitudes and strain ranges of practical concern.

Keywords

thin filmfatigueviscoelasticity
Type
Article
Information
Journal of Materials Research , Volume 34 , Issue 16 , 28 August 2019 , pp. 2903 - 2910
Copyright
Copyright © Materials Research Society 2019 

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References

Wu, W.: Inorganic nanomaterials for printed electronics: A review. Nanoscale 9, 7342 (2017).CrossRefGoogle ScholarPubMed
Seifert, T., Sowade, E., Roscher, F., Wiemer, M., Gessner, T., and Baumann, R.R.: Additive manufacturing technologies compared: Morphology of deposits of silver ink using inkjet and aerosol jet printing. Ind. Eng. Chem. Res. 54, 769 (2015).CrossRefGoogle Scholar
Glushko, O., Klug, A., List-Kratochvil, E.J., and Cordill, M.J.: Monotonic and cyclic mechanical reliability of metallization lines on polymer substrates. J. Mater. Res. 32, 1760 (2017).CrossRefGoogle Scholar
Sim, G., Won, S., and Lee, S.: Tensile and fatigue behaviors of printed Ag thin films on flexible substrates. Appl. Phys. Lett. 101, 191907 (2012).CrossRefGoogle Scholar
Glushko, O., Cordill, M.J., Klug, A., and List-Kratochvil, E.: The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates. Microelectron. Reliab. 56, 109 (2016).CrossRefGoogle Scholar
Kim, B., Lee, J., Yang, T., Haas, T., Gruber, P., Choi, I., Kraft, O., and Joo, Y.: Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates. J. Mater. Res. 29, 2827 (2014).CrossRefGoogle Scholar
Kim, B., Haas, T., Friederich, A., Lee, J., Nam, D., Binder, J.R., Bauer, W., Choi, I., Joo, Y., and Gruber, P.A.: Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices. Nanotechnology 25, 125706 (2014).CrossRefGoogle ScholarPubMed
ur Rehman, H., Ahmed, F., Schmid, C., Schaufler, J., and Durst, K.: Study on the deformation mechanics of hard brittle coatings on ductile substrates using in situ tensile testing and cohesive zone FEM modeling. Surf. Coat. Technol. 207, 163 (2012).CrossRefGoogle Scholar
Chen, B.F., Hwang, J., Chen, I.F., Yu, G.P., and Huang, J.: A tensile-film-cracking model for evaluating interfacial shear strength of elastic film on ductile substrate. Surf. Coat. Technol. 126, 91 (2000).CrossRefGoogle Scholar
Suo, Z. and Hutchinson, J.W.: Steady-state cracking in brittle substrates beneath adherent films. Int. J. Solids Struct. 25, 1337 (1989).CrossRefGoogle Scholar
Zhang, C., Chen, F., Gray, M.H., Tirawat, R., and Larsen, R.E.: An elasto-plastic solution for channel cracking of brittle coating on polymer substrate. Int. J. Solids Struct. 120, 125 (2017).CrossRefGoogle Scholar
Li, T., Huang, Z., Suo, Z., Lacour, S.P., and Wagner, S.: Stretchability of thin metal films on elastomer substrates. Appl. Phys. Lett. 85, 3435 (2004).CrossRefGoogle Scholar
Sim, G., Lee, Y., Lee, S., and Vlassak, J.J.: Effects of stretching and cycling on the fatigue behavior of polymer-supported Ag thin films. Mater. Sci. Eng., A 575, 86 (2013).CrossRefGoogle Scholar
Sivasubramony, R.S., Adams, N., Alhendi, M., Khinda, G.S., Kokash, M.Z., Lombardi, J.P., Raj, A., Thekkut, S., Weerawarne, D.L., and Yadav, M.: Isothermal fatigue of interconnections in flexible hybrid electronics based human performance monitors. In Electronic Components and Technology Conference, Vol. 68 (IEEE, California, 2018); pp. 896–903.Google Scholar
Lu, N., Wang, X., Suo, Z., and Vlassak, J.: Metal films on polymer substrates stretched beyond 50%. Appl. Phys. Lett. 91, 221909 (2007).CrossRefGoogle Scholar
Gall, D.: Electron mean free path in elemental metals. J. Appl. Phys. 119, 085101 (2016).CrossRefGoogle Scholar
Steinhögl, W., Schindler, G., Steinlesberger, G., Traving, M., and Engelhardt, M.: Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller. J. Appl. Phys. 97, 023706 (2005).CrossRefGoogle Scholar
Glushko, O., Kraker, P., and Cordill, M.J.: Explicit relationship between electrical and topological degradation of polymer-supported metal films subjected to mechanical loading. Appl. Phys. Lett. 110, 191904 (2017).CrossRefGoogle Scholar
Kokash, M.Z., Sivasubramony, R.S., Cuevas, J.T., Zamudio, A.F., Borgesen, P., Zinn, A.A., Stoltenberg, R.M., Chang, J., Tseng, Y-L., and Blass, D.: Assessing the reliability of high temperature solder alternatives. In Electronic Components and Technology Conference, Vol. 67 (IEEE, Florida, 2017); pp. 1978–1995.Google Scholar
Hamasha, S., Sharma, A., Schnabl, B., Cheng, L., Desir, D., Bretz, K., Wentlent, L., Zinn, A., Beddow, J., and Schnabl, K.: A nanocopper based alternative to high temperature solder. SMTA J. 30, 13 (2017).Google Scholar
Schnabl, K., Wentlent, L., Mootoo, K., Khasawneh, S., Zinn, A.A., Beddow, J., Hauptfleisch, E., Blass, D., and Borgesen, P.: Nanocopper based solder-free electronic assembly. J. Electron. Mater. 43, 4515 (2014).CrossRefGoogle Scholar
Salary, R.R., Lombardi, J.P., Tootooni, M.S., Donovan, R., Rao, P.K., Borgesen, P., and Poliks, M.D.: Computational fluid dynamics modeling and online monitoring of aerosol jet printing process. J. Manuf. Sci. Eng. 139, 021015 (2017).CrossRefGoogle Scholar
Salary, R.R., Lombardi, J.P., Rao, P.K., and Poliks, M.D.: Additive manufacturing (AM) of flexible electronic devices: Online monitoring of 3D line topology in aerosol jet printing process using shape-from-shading (SfS) image analysis. In International Manufacturing Science and Engineering Conference Collocated with the JSME/ASME 2017 6th International Conference on Materials and Processing, Vol. 12 (American Society of Mechanical Engineers, California, 2017); p. V002T01A046.Google Scholar
Wünscher, S., Abbel, R., Perelaer, J., and Schubert, U.S.: Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices. J. Mater. Chem. C 2, 10232 (2014).CrossRefGoogle Scholar
Ingham, B., Lim, T.H., Dotzler, C.J., Henning, A., Toney, M.F., and Tilley, R.D.: How nanoparticles coalesce: An in situ study of Au nanoparticle aggregation and grain growth. Chem. Mater. 23, 3312 (2011).CrossRefGoogle Scholar
Volkman, S.K., Yin, S., Bakhishev, T., Puntambekar, K., Subramanian, V., and Toney, M.F.: Mechanistic studies on sintering of silver nanoparticles. Chem. Mater. 23, 4634 (2011).CrossRefGoogle Scholar