Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-30T20:03:27.615Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of electric-current pulses on grain-structure evolution in cryogenically rolled copper

Published online by Cambridge University Press:  03 November 2014

Tatyana Konkova ,
Irshat Valeev ,
Sergey Mironov ,
Alexander Korznikov ,
Michail Myshlyaev  and
S. Lee Semiatin
Tatyana Konkova
Affiliation:
Institute for Metals Superplasticity Problems, Russian Academy of Science, Ufa 450001, Russia
Irshat Valeev
Affiliation:
Institute for Metals Superplasticity Problems, Russian Academy of Science, Ufa 450001, Russia
Sergey Mironov*
Affiliation:
Institute for Metals Superplasticity Problems, Russian Academy of Science, Ufa 450001, Russia; and Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
Alexander Korznikov
Affiliation:
Institute for Metals Superplasticity Problems, Russian Academy of Science, Ufa 450001, Russia; and National Research Tomsk State University, Tomsk 634050, Russia
Michail Myshlyaev
Affiliation:
Baikov Institute of Metallurgy and Material Science, Russian Academy of Science, Moscow 119991, Russia; and Institute of Solid State Physics, Russian Academy of Sciences, Chernogolovka, Moscow oblast 142432, Russia
S. Lee Semiatin
Affiliation:
Air Force Research Laboratory, Materials and Manufacturing Directorate, AFRL/RXCM, Wright-Patterson AFB, Ohio 45433-7817, USA
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The effect of electric-current pulses on the evolution of microstructure and texture in cryogenically rolled copper was determined. The pulsed material was found to be completely recrystallized, and the recrystallization mechanism was deduced to be similar to that operating during conventional static annealing. The microstructural changes were explained simply in terms of Joule heating. A significant portion of the recrystallization process was concluded to have occurred after pulsing; i.e., during cooling to ambient temperature. The grain structure and microhardness were shown to vary noticeably in the heat-affected zone (HAZ); these observations mirrored variations of temper colors. Accordingly, the revealed microstructure heterogeneity was attributed to the inhomogeneous temperature distribution developed during pulsing. In the central part of the HAZ, the mean grain size increased with current density and this effect was associated with the temperature rise per se. This grain size was slightly smaller than that in statically recrystallized specimens.

Keywords

Cumicrostructuretexture
Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 22 , 28 November 2014 , pp. 2727 - 2737
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Li, Y.S., Tao, N.R., and Lu, K.: Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures. Acta Mater. 56, 230 (2008).Google Scholar
Zhang, Y., Tao, N.R., and Lu, K.: Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles. Acta Mater. 56, 2429 (2008).CrossRefGoogle Scholar
Huang, Y. and Prangnell, P.B.: The effect of cryogenic temperature and change in deformation mode on the limiting grain size in a severely deformed dilute aluminium alloy. Acta Mater. 56, 1619 (2008).Google Scholar
Konkova, T., Mironov, S., Korznikov, A., and Semiatin, S.L.: Microstructural response of pure copper to cryogenic rolling. Acta Mater. 58, 5262 (2010).Google Scholar
Zherebtsov, S.V., Dyakonov, G.S., Salem, A.A., Sokolenko, V.I., Salishchev, G.A., and Semiatin, S.L.: Formation of nanostructures in commercial-purity titanium via cryorolling. Acta Mater. 61, 1167 (2013).Google Scholar
Konkova, T., Mironov, S., Korznikov, A., Myshlyaev, M.M., and Semiatin, S.L.: Annealing behaviour of cryogenically-rolled copper. Mater. Sci. Eng., A 585, 178 (2013).CrossRefGoogle Scholar
Conrad, H., Sprecher, A.F., Cao, W.D., and Lu, X.P.: Electroplasticity – The effect of electricity on the mechanical properties of metals. JOM 42, 28 (1990).Google Scholar
Conrad, H., Karam, N., and Mannan, S.: Effect of electric current pulses on the recrystallization of copper. Scr. Metall. 17, 411 (1983).Google Scholar
Conrad, H., Karam, N., and Mannan, S.: Effect of prior cold work on the influence of electric current pulses on the recrystallization of copper. Scr. Metall. 18, 275 (1984).Google Scholar
Conrad, H., Karam, N., Mannan, S., and Sprecher, A.F.: Effect of electric current pulses on the recrystallization kinetics of copper. Scr. Metall. 22, 235 (1988).Google Scholar
He, C.S., Zhang, Y.D., Wang, Y.N., Zhao, X., Zuo, L., and Esling, C.: Texture and microstructure development in cold-rolled interstitial free (IF) steel sheet during electric field annealing. Scr. Mater. 48, 737 (2003).CrossRefGoogle Scholar
Wang, X., Dai, W., Wang, R., Tian, X., and Zhao, X.: Enhanced phase transformation and variant selection by electric current pulses in a Cu-Zn alloy. J. Mater. Res. 29, 975 (2014).CrossRefGoogle Scholar
Valeev, I.Sh. and Kamalov, Z.G.: Structure evolution in copper resulting from the effect of powerful current pulses. J. Mater. Eng. Perform. 12, 272 (2003).Google Scholar
Dobatkin, S.V., Salischev, G.A., Kuznetsov, A.A., and Konkova, T.N.: Submicrocrystalline structure in copper after different severe plastic deformation schemes. Mater. Sci. Forum 558–559, 189 (2007).CrossRefGoogle Scholar
Knoepfel, H.: Pulsed High Magnetic Fields (North-Holland Publishing Company, Amsterdam, Netherlands, 1970), p. 392.Google Scholar
Konkova, T., Mironov, S., Korznikov, A., and Semiatin, S.L.: On the room-temperature annealing of cryogenically rolled copper. Mater. Sci. Eng., A 528, 7432 (2011).Google Scholar
Pospiech, J. and Lucke, K.: The rolling texture in copper and α-brass discussed in terms of the orientation distribution function. Acta Mater. 23, 997 (1975).CrossRefGoogle Scholar
Constable, F.H.: Spectrophotometric observations on the growth of oxide films on iron, nickel, and copper. Proc. R. Soc. London, Ser. A 117, 376 (1928).Google Scholar
Semiatin, S.L., Sukonnik, I.M., and Seetharaman, V.: An analysis of static recrystallization during continuous, rapid heat treatment. Metall. Mater. Trans. A 27, 2051 (1996).Google Scholar