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Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag

Published online by Cambridge University Press:  03 March 2011

Yee-Wen Yen ,
Chien-Chung Jao  and
Chiapyng Lee
Yee-Wen Yen
Affiliation:
Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
Chien-Chung Jao*
Affiliation:
Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China; and Department of Chemical and Materials Engineering, Ta Hwa Institute of Technology, Hsinchu 307, Taiwan, Republic of China
Chiapyng Lee
Affiliation:
Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The effect of Cu added eutectic Sn–9Zn solder reacting with the Ag substrate has been investigated in this study. Three Ag–Zn intermetallic compounds (IMCs), ∈–AgZn3, γ–Ag5Zn8, and ζ–AgZn, were formed on the Sn–9Zn/Ag interface at 260 °C. While Cu was gradually added to the Sn–9Zn alloy, microstructures of intermetallic compounds changed dramatically. The intermetallic compound microstructures became loose and Sn and Cu atoms in the Ag-Zn intermetallic compounds increased. If more than 3 wt% of Cu was added to the Sn-9Zn alloy, Ag-Sn intermetallic compounds were formed on the Ag surface and massive spalling of Ag–Zn IMC layers from the Ag surface occurred in a short reaction time.

Keywords

Soldering
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 12 , December 2006 , pp. 2986 - 2990
Copyright
Copyright © Materials Research Society 2006

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