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Control of nanosilver sintering attained through organic binder burnout

Published online by Cambridge University Press:  31 January 2011

John G. Bai*
Affiliation:
Center for Power Electronics Systems and Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
Thomas G. Lei
Affiliation:
Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
Jesus N. Calata
Affiliation:
Center for Power Electronics Systems and Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
Guo-Quan Lu
Affiliation:
Center for Power Electronics Systems, Department of Materials Science and Engineering, and Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Control of the low-temperature sintering of nanosilver particles was attained by dispersing and stabilizing nanosilver particles into a paste form using the selected organic binder systems. As demonstrated by scanning electron microscopy (SEM) and thermogravimetric analysis (TGA), with the existing binder systems, undesirable premature coalescence of nanosilver particles was prevented and the metastable structure was retained until the binder burned out at relatively higher temperatures. Enhanced densification was achieved upon the binder burnout because at the relatively higher temperatures the densification mechanisms, e.g., grain-boundary or lattice diffusion, become more dominant. We propose that the onset of sintering, extent of densification, and final grain size can be controlled by either the size of the initial nanosilver particles or the binder systems with different burnout characteristics.

Type
Articles
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Mayo, M.J.: Processing of nanocrystalline ceramics from ultrafine particles. Int. Mater. Rev. 41, 85 1996CrossRefGoogle Scholar
2Groza, J.R.: Nanosintering. Nanostruct. Mater. 12, 987 1999Google Scholar
3Bai, J.G., Zhang, Z.Z., Calata, J.N.Lu, G.Q.: Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material. IEEE Trans. Compon. Packag. Technol. 29, 589 2006CrossRefGoogle Scholar
4Bai, J.G.Lu, G.Q.: Thermomechanical reliability of low-temperature sintered silver die-attached SiC power device assembly. IEEE Trans. Device Mater. Reliab. 6, 436 2006CrossRefGoogle Scholar
5Harmer, M.P.Brook, R.J.: Fast firing±microstructural benefits. J. British Ceram. Soc. 80, 147 1981Google Scholar
6German, R.M.: Sintering Theory and Practice John Wiley New York 1996Google Scholar
7Powen, P.Carry, C.: From powders to sintered pieces: Forming, transformations and sintering of nanostructured ceramic oxides. Powder Technol. 128, 248 2002Google Scholar
8Rahaman, M.N.: Ceramic Processing and Sintering Marcel Dekker New York 1995Google Scholar
9Freim, J., McKittrick, J., Katz, J.Sickafus, K.: Microwave sintering of nanocrystalline γ-Al2O3. Nanostruct. Mater. 4, 371 1994Google Scholar
10Groza, J.R.Zavaliangos, A.: Nanostructured bulk solids by field activated sintering. Rev. Adv. Mater. Sci. 5, 24 2003Google Scholar
11Wang, S.W., Chen, L.D.Hirai, T.: Densification of Al2O3 powder during spark plasma sintering. J. Mater. Res. 15, 982 2000Google Scholar
12Xu, G., Lloyd, I.K., Carmel, Y., Olorunyolemi, T.Wilson, O.C.: Microwave sintering of ZnO at ultra high heating rate. J. Mater. Res. 16, 2850 2001CrossRefGoogle Scholar
13Fuller, S.B., Wilhelm, E.J.Jacobson, J.M.: Ink-jet printed nanoparticle microelectromechanical systems. J. Microelectromech. Sys. 11, 54 2002CrossRefGoogle Scholar
14Napper, D.H.: Polymeric Stabilization of Colloidal Dispersions Academic Press New York 1983Google Scholar
15Choe, J.W., Calata, J.N.Lu, G.Q.: Constrained-film sintering of a gold circuit paste. J. Mater. Res. 10, 986 1995CrossRefGoogle Scholar