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Boron loss in furnace- and laser-fired, sol-gel derived borosilicate glass films

Published online by Cambridge University Press:  31 January 2011

D. J. Taylor
Affiliation:
Department of Materials Science and Engineering, University of Arizona, Tucson, Arizona 85721
D. Z. Dent
Affiliation:
Department of Materials Science and Engineering, University of Arizona, Tucson, Arizona 85721
D. N. Braski
Affiliation:
High Temperature Materials Laboratory, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
B.D. Fabes
Affiliation:
Department of Materials Science and Engineering, University of Arizona, Tucson, Arizona 85721
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Abstract

Borosilicate glass films were made by the sol-gel method from tetraethoxysilane and trimethylborate precursors. The precursor or glass composition at each stage of processing was analyzed to determine the sources of boron loss. The films were heated in a furnace and with a laser to compare boron volatilization by the two heating methods. The films were characterized by infrared spectroscopy, ellipsometry, induction-charged plasma spectroscopy, and Auger microscopy. The highest losses of boron occurred during coating and low temperature (<500 °C) furnace firing. Films with the highest boron concentrations were made by dip coating and rapid firing, either with a laser or by placing them into a hot furnace. Infrared spectroscopy revealed Si–O–B bonds, indicating incorporation of boron into the borosilicate glass structure for laser- and furnace-fired films.

Type
Articles
Copyright
Copyright © Materials Research Society 1996

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References

REFERENCES

1.Ilyas, M. and Hogarth, C. A., J. Mater. Sci. Lett. 2, 535 (1983).CrossRefGoogle Scholar
2.Sanchez, G., Castaño, J. L., Garrido, J., Martinez, J., and Piqueras, J., J. Electrochem. Soc. 138, 3039 (1991).CrossRefGoogle Scholar
3.Bagratishvili, G. D., Dzhanelidze, R. B., Jishiashvili, D. A., Piskanovskii, L. V., and Shiolashvili, Z. N., Phys. Status Solidi A 56, 27 (1979).CrossRefGoogle Scholar
4.Miyake, M., J. Electrochem. Soc. 138, 3031 (1991).CrossRefGoogle Scholar
5.Nogami, M. and Moriya, Y., J. Non-Cryst. Solids 48, 359 (1982).CrossRefGoogle Scholar
6.Kumar, B., Mater. Res. Bull. 19, 331 (1984).CrossRefGoogle Scholar
7.Irwin, A. D., Holmgren, J.S., Zerda, T. W., and Jonas, J., J. Non-Cryst. Solids 89, 191 (1987).CrossRefGoogle Scholar
8.Tohge, N., Matsuda, A., and Minami, T., J. Am. Ceram. Soc. 70, C13 (1987).Google Scholar
9.Tohge, N. and Minami, T., J. Non-Cryst. Solids 112, 432 (1989).CrossRefGoogle Scholar
10.Fabes, B. D., Zelinski, B. J. J., and Uhlmann, D. R., in Ceramic Films and Coatings, edited by Watchman, J. B. and Haber, R. A. (Noyes, 1992).Google Scholar
11.Arai, E. and Terunuma, Y., J. Electrochem. Soc. 121, 676 (1974).CrossRefGoogle Scholar
12.Yamanaka, S., Akagi, J., and Hattori, M., J. Non-Cryst. Solids 70, 279 (1985).CrossRefGoogle Scholar
13.Taft, E. A., Electrochem. Soc. 118, 1985 (1971).CrossRefGoogle Scholar
14.Zaugg, T. C., Fabes, B. D., Weisenbach, L., and Zelinski, B. J. J., in Submolecular Glass Chemistry and Physics, edited by Bray, P. and Kreidl, N. J. (SPIE Vol. 1590, Bellingham, WA, 1991), p. 26.CrossRefGoogle Scholar
15.Chia, T., Hench, L. L., Qin, C., and Hsieh, C. K., in Better Ceramics Through Chemistry IV, edited by Zelinski, B.J.J., Brinker, C. J., Clark, D. E., and Ulrich, D. R. (Mater. Res. Soc. Symp. Proc. 180, Pittsburgh, PA 1990), p. 819.Google Scholar
16.Taylor, D. J., Birnie, D. P. III, and Fabes, B. D., J. Mater. Res. 10, 1429 (1995).CrossRefGoogle Scholar
17.Taylor, D. J., Fabes, B. D., and Seinthal, M. G., in Better Ceramics Through Chemistry IV, edited by Zelinski, B.J.J., Brinker, C. J., Clark, D. E., and Ulrich, D. R. (Mater. Res. Soc. Symp. Proc. 180, Pittsburgh, PA, 1990), p. 1047.Google Scholar
18.Tenney, A. S. and Wong, J., J. Chem. Phys. 56, 5516 (1972).CrossRefGoogle Scholar
19.Boyd, I. W. and Wilson, J.I.B., J. Appl. Phys. 53, 4166 (1982).CrossRefGoogle Scholar
20.Taylor, D. J. and Fabes, B. D., J. Non-Cryst. Solids 147 / 148, 457 (1992).CrossRefGoogle Scholar
21.Brinker, C. J., Hurd, A. J., Frye, G. C., Schunk, P. R., and Ashley, C. S., in Chemical Processing of Advanced Materials, edited by Hench, L. L. and West, J.K. (John Wiley and Sons, Inc., New York, 1992), pp. 395413.Google Scholar
22.Scriven, L. E., in Better Ceramics Through Chemistry III, edited by Brinker, C. J., Clark, D. E., and Ulrich, D. R. (Mater. Res. Soc. Symp. Proc. 121, Pittsburgh, PA, 1988).Google Scholar