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Bonding strength of a carbon nanofiber array to its substrate

Published online by Cambridge University Press:  03 March 2011

Yi Zhang ,
Ephraim Suhir ,
Yuan Xu  and
Claire Gu
Yi Zhang
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
Ephraim Suhir*
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
Yuan Xu
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
Claire Gu
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The bonding strength of a carbon nanofiber array (CNFA) grown on a copper substrate is evaluated based on the measured shearing force-at-failure and the developed analytical stress model that enables one to determine the magnitude and the distribution of the interfacial shearing stress causing the measured (given) shearing force. The experiment is conducted using specially designed test specimens. A table version of the Instron tester is used to measure the applied force and the corresponding displacement in shear. The maximum predicted shear-off stress is about 300 psi (0.211 kgf/m2), and was determined, based on the developed stress model, as a product of the measured 5 kgf/m force at the interface failure and the computed parameter k = 0.0422 m–1 of the interfacial shearing stress.

Keywords

BondingNanostructureStrength
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 11 , November 2006 , pp. 2922 - 2926
Copyright
Copyright © Materials Research Society 2006

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References

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