Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Aurelio, G.
Sommadossi, S. A.
and
Cuello, G. J.
2012.
Neutron diffraction study of stability and phase transitions in Cu-Sn-In alloys as alternative Pb-free solders.
Journal of Applied Physics,
Vol. 112,
Issue. 5,
Aurelio, G.
Sommadossi, S.A.
and
Cuello, G.J.
2012.
Crystal Structure of Cu-Sn-In Alloys Around the η-Phase Field Studied by Neutron Diffraction.
Journal of Electronic Materials,
Vol. 41,
Issue. 11,
p.
3223.
Gierlotka, Wojciech
2012.
Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System.
Journal of Electronic Materials,
Vol. 41,
Issue. 1,
p.
86.
Lin, Shih-kang
Hsu, Che-wei
Chen, Sinn-wen
and
Hsu, Chia-ming
2013.
Interfacial reactions in Sn–20In–2.8Ag/Cu couples.
Materials Chemistry and Physics,
Vol. 142,
Issue. 1,
p.
268.
Tian, Feifei
Liu, Zhi-Quan
Shang, Pan-Ju
and
Guo, Jingdong
2014.
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate.
Journal of Alloys and Compounds,
Vol. 591,
Issue. ,
p.
351.
Lin, Shih-Kang
Chang, Ru-Bo
Chen, Sinn-Wen
Tsai, Ming-Yueh
and
Hsu, Chia-Ming
2014.
Effects of zinc on the interfacial reactions of tin–indium solder joints with copper.
Journal of Materials Science,
Vol. 49,
Issue. 10,
p.
3805.
Lin, Shih-kang
Nguyen, Trong Lan
Wu, Shu-chang
and
Wang, Yu-hsiang
2014.
Effective suppression of interfacial intermetallic compound growth between Sn–58wt.% Bi solders and Cu substrates by minor Ga addition.
Journal of Alloys and Compounds,
Vol. 586,
Issue. ,
p.
319.
Yen, Yee-wen
Hsiao, Hsien-Ming
Shao, Pei-Sheng
and
Chang, Yen Wei
2015.
A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders.
Journal of Electronic Materials,
Vol. 44,
Issue. 10,
p.
3914.
Lin, Shih-kang
Chang, Ru-Bo
Chen, Sinn-wen
Tsai, Ming-yueh
and
Hsu, Chia-ming
2015.
Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni substrates.
Materials Chemistry and Physics,
Vol. 154,
Issue. ,
p.
60.
Lin, Shih-kang
Wang, Yu-hsiang
and
Kuo, Hui-chin
2015.
Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °C.
Intermetallics,
Vol. 58,
Issue. ,
p.
91.
Zhou, Shiqi
Yang, Chih-han
Lin, Shih-kang
AlHazaa, Abdulaziz N.
Mokhtari, Omid
Liu, Xiangdong
and
Nishikawa, Hiroshi
2019.
Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy.
Materials Science and Engineering: A,
Vol. 744,
Issue. ,
p.
560.
Yang, Ting-Li
Liu, Yu-chen
Yang, Chih-han
Kuo, Yi-kai
and
Lin, Shih-kang
2020.
Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions.
JOM,
Vol. 72,
Issue. 10,
p.
3538.
Wang, Jingze
Mao, Dongxin
Chen, Hongtao
Zhang, Xiaohua
Shi, Lei
and
Wang, Jianbing
2020.
Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces.
Journal of Electronic Materials,
Vol. 49,
Issue. 2,
p.
1512.
Han, Duy Le
Shen, Yu-An
Huo, Fupeng
and
Nishikawa, Hiroshi
2021.
Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints.
Metals,
Vol. 12,
Issue. 1,
p.
33.
Han, Duy Le
Shen, Yu-An
He, Siliang
and
Nishikawa, Hiroshi
2021.
Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy.
Materials Science and Engineering: A,
Vol. 804,
Issue. ,
p.
140785.
Kelly, Marion Branch
Antoniswamy, Aravindha
Mahajan, Ravi
and
Chawla, Nikhilesh
2021.
Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration.
Journal of Electronic Materials,
Vol. 50,
Issue. 3,
p.
893.
Vuorinen, V.
Dong, H.
Ross, G.
Hotchkiss, J.
Kaaos, J.
and
Paulasto-Kröckel, M.
2021.
Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures.
Journal of Electronic Materials,
Vol. 50,
Issue. 3,
p.
818.
Velikanova, Tamara
Turchanin, Michail
Fabrichnaya, Olga
Huang, Dandan
Wang, Yao
Xu, Liping
and
Xia, Dechen
2022.
Cu-In-Sn Ternary Phase Diagram Evaluation.
MSI Eureka,
Vol. 91,
Issue. ,
p.
10.21071.2.0.
Emadi, Fahimeh
Vuorinen, Vesa
and
Paulasto-Krockel, Mervi
2022.
Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging.
p.
359.
Emadi, F.
Vuorinen, V.
Ross, G.
and
Paulasto-Kröckel, M.
2023.
Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics.
Materials Science and Engineering: A,
Vol. 881,
Issue. ,
p.
145398.