Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Parker, Mark A.
and
Cotanche, Douglas A.
2004.
The Potential Use of Stem Cells for Cochlear Repair.
Audiology and Neurotology,
Vol. 9,
Issue. 2,
p.
72.
Ross, Liz
2008.
Modernizing times: UK hearing‐impaired consumers at the policy crossroads.
International Journal of Consumer Studies,
Vol. 32,
Issue. 2,
p.
122.
Ross, Liz
Cathcart, Craig
and
Lyon, Phil
2011.
Consumer choice for hearing aids and listening devices: newspaper advertisements for UK private sector provision.
International Journal of Consumer Studies,
Vol. 35,
Issue. 1,
p.
95.
Medina, Camila
Ferrari, Deborah Viviane
and
Domiciano, Cassia Letícia Carrara
2015.
A evolução dos manuais de instrução das próteses auditivas sob a perspectiva do design.
p.
1407.
Lee, Seung Hyun
Seong, Ki Woong
Lee, Kyu-Yup
and
Shin, Dong Ho
2020.
Optimization and Performance Evaluation of a Transducer for Bone Conduction Implants.
IEEE Access,
Vol. 8,
Issue. ,
p.
100448.
Shin, Dong Ho
and
Cho, Hui-Sup
2021.
An Assembly Quality Inspection System for Bone Conduction Implant Transducers.
IEEE Access,
Vol. 9,
Issue. ,
p.
104653.
Shin, D. H.
Seong, K. W.
Kim, M. N.
and
Lee, K. Y.
2022.
Finite element design of a vibrational membrane to reduce distortion in a bone‐conduction implant transducer.
Electronics Letters,
Vol. 58,
Issue. 5,
p.
185.
Ross, Florian
2022.
New Realities, Mobile Systems and Applications.
Vol. 411,
Issue. ,
p.
735.
Katar, Oğuzhan
and
Bajin, Demir
2023.
Beauty, Aging, and AntiAging.
p.
359.
Shin, Dong Ho
Seong, Ki Woong
and
Lee, Kyu-Yup
2023.
Effect of Driver Mass Loading on Bone Conduction Transfer in an Implantable Bone Conduction Transducer.
IEEE Access,
Vol. 11,
Issue. ,
p.
19269.
Shin, Dong Ho
Lee, Kyu-Yup
and
Seong, Ki Woong
2024.
An acoustic bellows-type round window transducer for middle-ear implants.
Clinical Biomechanics,
Vol. 120,
Issue. ,
p.
106349.
Shin, Dong Ho
and
Seong, Ki Woong
2024.
A piezoelectric transducer for bone conduction implants designed using finite element analysis.
Electronics Letters,
Vol. 60,
Issue. 12,