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Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

Published online by Cambridge University Press:  18 March 2011

Christophe Calvez ,
Romain Pilard ,
Christian Person ,
Jean-Philippe Coupez ,
François Gallée ,
Frédéric Gianesello ,
Hilal Ezzeddine  and
Daniel Gloria
Christophe Calvez*
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
Romain Pilard*
Affiliation:
STMicroelectronics – 850, rue Jean Monnet, 38926 Crolles, France. Phone:  + 33 4 38 92 37 68.
Christian Person
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
Jean-Philippe Coupez
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
François Gallée
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
Frédéric Gianesello
Affiliation:
STMicroelectronics – 850, rue Jean Monnet, 38926 Crolles, France. Phone:  + 33 4 38 92 37 68.
Hilal Ezzeddine
Affiliation:
STMicroelectronics – 16, rue Pierre et Marie Curie, 37100 Tours, France.
Daniel Gloria
Affiliation:
STMicroelectronics – 850, rue Jean Monnet, 38926 Crolles, France. Phone:  + 33 4 38 92 37 68.
*
Corresponding authors: C. Calvez and R. Pilard Emails: [email protected], [email protected]
Corresponding authors: C. Calvez and R. Pilard Emails: [email protected], [email protected]
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Abstract

Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.

Keywords

Antenna DesignModelling and MeasurementsAntennas and Propagation for Wireless Systems
Type
Research Article
Information
International Journal of Microwave and Wireless Technologies , Volume 3 , Special Issue 2: 60 GHz Wireless Communication Circuits and Systems , April 2011 , pp. 179 - 188
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2011

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References

REFERENCES

[1]Reynolds, S.K. et al. : A silicon 60-GHz receiver and transmitter chipset for broadband communications. IEEE J. Solid-State Circuits, 41 (12) (2006).Google Scholar
[2]Tomkins, A. et al. : A zero-IF 60 GHz transceiver in 65 nm CMOS with >3.5Gb/s links, in IEEE Custom Integrated Circuits Conf., CICC 2008, 21–24 September 2008, pp. 471–474.3.5Gb/s+links,+in+IEEE+Custom+Integrated+Circuits+Conf.,+CICC+2008,+21–24+September+2008,+pp.+471–474.>Google Scholar
[3]Marcu, C. et al. : A 90 nm CMOS low-power 60 GHz transceiver with integrated baseband circuitry, in ISSCC 2009, 2009, pp. 314–315.Google Scholar
[4]http://ieee802.org/15/pub/TG3c.html.Google Scholar
[5]Pinto, Y. et al. : 79 GHz integrated antenna on low resistivity Si BiCMOS exploiting above-IC processing, in 3rd European Conf. on Antennas and Propagation, EuCAP 2009, pp. 3539–3543, 23–27 March 2009.Google Scholar
[6]Pilard, R. et al. : Folded-slot integrated antenna array for millimeter-wave CMOS applications on standard HR SOI silicon substrate, in IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF ‘09, 19–21 January 2009, pp. 1–4.CrossRefGoogle Scholar
[7]Montusclat, S. et al. : Silicon full integrated LNA, filter and antenna system beyond 40 GHz for MMW wireless communication links in advanced CMOS technologies, in IEEE Radio Frequency Integrated Circuits (RFIC) Symp. 2006, 11–13 June 2006, pp. 4–80.Google Scholar
[8]Pilard, R. et al. : Dedicated measurement setup for millimeter-wave silicon integrated antennas: BiCMOS and CMOS high resistivity SOI process characterization, in EuCAP, March, 2009.Google Scholar
[9]Avenier, G. et al. : 0.13 µm SiGe BiCMOS technology for mm-wave applications, in IEEE Bipolar/BiCMOS Circuits and Technology Meeting, Austin, TX, USA, 2008, pp. 89–92.CrossRefGoogle Scholar
[10]Gianesello, F. et al. : 325 GHz CPW band pass filter integrated in advanced HR SOI CMOS technology, in European Microwave Week, Paris, France, 2010.Google Scholar
[11]Chan, K.T. et al. : Integrated antennas on Si, proton-implanted Si and Si-on-quartz, in Technical Digest of Int. Electron Devices Meeting, Washington, DC, USA, 2007, pp. 40.6.1–40.6.4.Google Scholar
[12]Hoivik, N. et al. : High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques, in Int. Symp. on Antennas and Propagation Society, Hawaii, USA, 2007, pp. 5043–4046.CrossRefGoogle Scholar
[13]Aspar, B. et al. : IC's performance improvement and 3D integration by layer transfer technologies, in Int. SOI Conf., 2006, pp. 8–11.Google Scholar
[14]Zwick, T. et al. : Broadband planar superstrate antenna for integrated millimeterwave transceivers. IEEE J. Antennas Propag., 54 (10) (2006).Google Scholar
[15]Liu, D. et al. : A patch array antenna for 60 GHz package applications in Antennas and Propagation Society Int. Symp., AP-S 2008, IEEE 5–11 July 2008, pp. 1–4.Google Scholar
[16]Lanteri, J. et al. : 60 GHz antennas in HTCC and glass technology, in Proc. Fourth European Conf. on Antennas and Propagation 2010, 12–16 April 2010, pp. 1–4.Google Scholar
[17]Calvez, C. et al. : New millimeter wave packaged antenna array on IPD technology in IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2010, 11–13 January 2010.CrossRefGoogle Scholar