Hostname: page-component-78c5997874-t5tsf Total loading time: 0 Render date: 2024-11-16T09:23:47.336Z Has data issue: false hasContentIssue false
  • English
  • Français

Low-cost TRM technologies for phased array radars

Published online by Cambridge University Press:  19 June 2009

Håkan Berg ,
Heiko Thiesies  and
Niklas Billström
Håkan Berg*
Affiliation:
Microwave & Antennas, Saab Microwave Systems, Saab AB, SE-412 89 Göteborg, Sweden.
Heiko Thiesies
Affiliation:
Microwave & Antennas, Saab Microwave Systems, Saab AB, SE-412 89 Göteborg, Sweden.
Niklas Billström
Affiliation:
Microwave & Antennas, Saab Microwave Systems, Saab AB, SE-412 89 Göteborg, Sweden.
*
Corresponding author: H. Berg Email: [email protected]
Get access Rights & Permissions [Opens in a new window]

Abstract

Low-cost enabling technologies for T/R modules (TRMs) in phased array radars are proposed and analyzed in terms of technology, performance, and cost aspects. Phase and amplitude controlling integrated circuits (ICs) realized in a low-cost standard silicon process are demonstrated. The design of several ICs at the S-, C-, on X-band has shown that silicon germanium is a strong contender for gallium arsenide. This also applies to TRMs suited for military active phased array antenna (AESA) radars. The circuits presented in this paper are manufactured by austriamicrosystems in their 0.35 µm SiGe-BiCMOS process with an fT of around 70 GHz. A TRM packaging concept based on soldered surface-mount technology and organic substrates is also demonstrated. A cost analysis concludes that by using the proposed packaging concept and the SiGe core-chip technology, the TRM production cost can be potentially reduced by 70% compared to traditional ceramic hermetic packaging with core chip in GaAs technology.

Keywords

BiCMOS integrated circuitsMMICsPhased array radarMultichip modulesSurface mountingPrinted circuitsLife cycle costing
Type
Original Article
Information
International Journal of Microwave and Wireless Technologies , Volume 1 , Special Issue 4: European Microwave Week 2008 , August 2009 , pp. 369 - 375
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]Thiesies, H.; Berg, H.: A phase and amplitude control front end chip in SiGe for phased-array C-band radar applications, in Proc. IEEE MTT-S., 2005.CrossRefGoogle Scholar
[2]Billström, N. et al. : T/R “core chips” for S-, C- and, X-band radar systems, in Proc. EuMC, 2004, 1029–1032.Google Scholar
[3]Berg, H.; Thiesies, H.; Hemmendorff, E.; Sidiropoulos, G.; Hedman, J.: Silicon-germanium for phased array radars, in Proc. EuMW, 2008.CrossRefGoogle Scholar
[4]Tayrani, R.: Broad-band SiGe MMICs for phased-array radar applications. IEEE J. Solid State Circuits, 38 (2003), 1462–1470.CrossRefGoogle Scholar
[5]Mitchell, M.A.: An X-band SiGe single-MMIC transmit/recieve module for radar applications, in Proc. Radar, 2007, 664–669.CrossRefGoogle Scholar
[6]Axelsson, K.: Generic packaging tecnologies for T/R-modules, in Proc. EuMC, 2005, 805–808.CrossRefGoogle Scholar
[7]Barbier, T.; Brouzes, H.; Guillerme, Y.; Fellon, P.; Stahl, J.; Van Vliet, F.: Modules integres hyperfrequences 2–18 GHz pour assemblage en surface, in Proc. JNM, 2005.Google Scholar
[8]“Surface-Mount Technologies For Active Modules Production (STAMP)”, EUROPA Contract No 05/102.086/019.Google Scholar