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Ku/Ka band diplexer based on thin-film technology for small ground-segment user terminals

Published online by Cambridge University Press:  11 June 2021

Stefano Moscato*
Affiliation:
SIAE Microelettronica S.p.A., R&D Microwave Laboratory, 20093Cologno Monzese (MI), Italy
Giandomenico Cannone
Affiliation:
SIAE Microelettronica S.p.A., R&D Microwave Laboratory, 20093Cologno Monzese (MI), Italy
Matteo Oldoni
Affiliation:
SIAE Microelettronica S.p.A., R&D Microwave Laboratory, 20093Cologno Monzese (MI), Italy
Davide Tiradossi
Affiliation:
RF Microtech, 06132Perugia (PG), Italy
Luca Pelliccia
Affiliation:
RF Microtech, 06132Perugia (PG), Italy
Petar Jankovic
Affiliation:
European Space Agency, NL-2200, AG Noordwijk, The Netherlands
Fabrizio De Paolis
Affiliation:
European Space Agency, European Centre for Space Applications and Telecommunications (ESA/ECSAT), DidcotOX11 0FD, U.K
*
Author for correspondence: Stefano Moscato, E-mail: [email protected]

Abstract

This paper describes the outcome of the “Small user TErminal multi band DIplexer” project where the goal is the validation of novel SMD-compliant planar diplexer. The real application scenario concerns an integrated multi-band radio terminal for ground-segment satellite links. The advantageous and novel approach involves the simultaneous use of three different well-established concepts: a microstrip low-pass filter, a substrate integrated waveguide high-pass filter, and the thin-film technology as manufacturing process. The proposed topology applied to a planar alumina-based design guarantees a 15 × 11.1 mm2 footprint and the best integration with surface mountable soldering process over standard PCB technology. Achieved performance and resilience to environmental toughness are suitable for consumer-oriented satellite links or man-pack applications. The designed component targets the Ku 10.7–12.75 (RX) and Ka 27.5–30 (TX) GHz bands but the layout can be easily tuned across the spectrum. The described solution has been manufactured and validated. Thermal cycling and mechanical tests have been carried out to prove the high technology readiness level of the proposed device.

Type
Research Paper
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press in association with the European Microwave Association

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