Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-03T01:25:53.412Z Has data issue: false hasContentIssue false
  • English
  • Français

Antenna-in-package (AiP) in mm-wave band

Published online by Cambridge University Press:  23 January 2013

Mahmoud Alhenawy  and
Martin Schneider
Mahmoud Alhenawy*
Affiliation:
Institute of Telecommunications and High-Frequency Techniques, RF & Microwave Engineering Laboratory, University of Bremen, Bremen, Germany. Phone: +4942121862417
Martin Schneider
Affiliation:
Institute of Telecommunications and High-Frequency Techniques, RF & Microwave Engineering Laboratory, University of Bremen, Bremen, Germany. Phone: +4942121862417
*
Corresponding author: M. Alhenawy Email: [email protected]
Get access Rights & Permissions [Opens in a new window]

Abstract

We studied the viability of the embedded wafer level ball grid array (eWLB) package environment as an antenna platform for 77 GHz automotive radar sensors and the effects of package fabrication tolerances on the antenna performance. The investigation of different antenna concepts in the eWLB package and their characterization methods are addressed. The design procedures for electrically large, differentially fed loop antennas in a multilayer package structure are introduced. Two different planar antennas are developed and measured in an eWLB package showing promising results such as a gain of 9 GHz and an impedance bandwidth of 8 GHz. An acceptable antenna performance is recorded within the tolerance limits. Therefore, the eWLB package is seen as an appropriate platform for mm-wave antennas and as a good candidate for an antenna-in-package (AiP) concept.

Keywords

Antenna designModelling and measurementsRadar application
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 5 , Special Issue 1: Special Issue on the German RoCC Project , February 2013 , pp. 55 - 64
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]Zhang, Y.P.; Liu, Duixian. etc: Antenna-on-chip and antenna-in-package solutions to highly integrated millimeter-wave devices for wireless communications. IEEE Trans. Antennas Propag., 57 (10): (2009), 2830–2841.Google Scholar
[2]Hasch, J.; Wostradowski, U.; Gaier, S.; Hansen, T. etc: 77 GHz radar transceiver with dual integrated antenna elements. in German Microwave Conf., Berlin, Germany, March 2010, 280–283.Google Scholar
[3]Takeuchi, J., Hirata, A., Takahashi, H., and Kukutsu, N.: 10-Gbit/s bi-directional and 20-Gbit/s uni-directional data transmission over a 120-GHz-band wireless link using a finline ortho-mode transducer, in Microwave Conf. Proc. (APMC), 2010 Asia-Pacific, Yokohama, Japan, December 2010, 195–198.Google Scholar
[4]Lopez, A.V., Papapolymerou, J., Akiba, A., Ikeda, K., Mitarai, S., and Ponchak, G.: 60 GHz micromachined patch antenna for wireless applications, in IEEE Int. Symp. on Antennas and Propagation (APSURSI), Washington, USA, July 2011, 515–518, doi: 10.1109/APS.2011.5996758.Google Scholar
[5]Carrillo-Ramirez, R. and Jackson, R.W.: A Highly Integrated Millimeter-wave Active Antenna Array Using BCB and Silicon Substrate. IEEE Trans. Microw. Theory Tech., 52 (6) (2004), 1648–1653.Google Scholar
[6]Alhenawy, M. and Schneider, M.: Integrated antennas in eWLB packages for 77 GHz and 79 GHz automotive radar sensors, in 41st European Microwave Conf. (EuMC), Manchester, United kingdom, October 2011, 1312 –1315.Google Scholar
[7]Fischer, A., Tong, Ziqiang, Hamidipour, A., Maurer, L., and Stelzer, A.: A 77-GHz antenna in package, in 41st European Microwave Conf. (EuMC), Manchester, United kingdom, October 2011, 1316–1319.Google Scholar
[8]Brunnbauer, M., Furgut, E., Beer, G., and Meyer, T.: Embedded wafer level ball grid array (eWLB), in Eighth Electronics Packaging Technology Conf., EPTC '06, Singapore, December 2006, 1–5, doi: 10.1109/EPTC.2006.342681.Google Scholar
[9]Meyer, T., Ofner, G., Bradl, S., Brunnbauer, M., and Hagen, R.: Embedded wafer level ball grid array (eWLB), in 10th Electronics Packaging Technology Conf., 2008. EPTC, Singapore, December 2008, 994–998, doi: 10.1109/EPTC.2008.4763559.Google Scholar
[10]Pressel, K., et al. : Embedded wafer level ball grid array (eWLB) technology for system integration, in IEEE CPMT Symp. Japan, 2010, August 2010, 1–4, doi: 10.1109/CPMTSYMPJ.2010.5679657.Google Scholar
[11]Alhenawy, M. and Schneider, M.: Rectangular waveguide to coplanar stripline transition based on a unilateral finline, in Proc. Fourth European Conf. on Antennas and Propagation (EuCAP), Prague, Czech Republic, April 2012.Google Scholar
[12]Pocklington, H.C.: Electrical oscillations in wires, in Cambridge Philosophical Society Proc., University Press, volume 9, 1897, 324.Google Scholar