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Robustness study of bandpass NGD behavior of ring-stub microstrip circuit under temperature variation

Published online by Cambridge University Press:  23 November 2021

Hongyu Du Open the ORCID record for Hongyu Du [Opens in a new window] ,
Fayu Wan Open the ORCID record for Fayu Wan [Opens in a new window] ,
Sébastien Lalléchère ,
Wenceslas Rahajandraibe  and
Blaise Ravelo
Hongyu Du
Affiliation:
Nanjing University of Information Science & Technology (NUIST), Nanjing 210044, Jiangsu, China
Fayu Wan*
Affiliation:
Nanjing University of Information Science & Technology (NUIST), Nanjing 210044, Jiangsu, China
Sébastien Lalléchère
Affiliation:
Université Clermont Auvergne, Institut Pascal, SIGMA Clermont, Clermont-Ferrand, France
Wenceslas Rahajandraibe
Affiliation:
Aix-Marseille University, CNRS, University of Toulon, IM2NP UMR7334, Marseille, France
Blaise Ravelo
Affiliation:
Nanjing University of Information Science & Technology (NUIST), Nanjing 210044, Jiangsu, China
*
Author for correspondence: Fayu Wan, E-mail: [email protected]
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Abstract

This paper explores an original study of bandpass (BP) negative group delay (NGD) robustness applied to the ring-stub passive circuit. The proof of concept (PoC) circuit is constituted by a ring associated with the open-end stub implemented in microstrip technology. An innovative experimental setup of a temperature room containing the NGD PoC connected to a vector network analyzer is described. Then, the electrothermal data of S-parameters are measured by varying the ambient or room temperature range from 20 to 60°C, i.e. 40°C maximal variation. The empirical results of the group delay (GD), transmission and reflection coefficient mappings versus the couple (temperature, frequency) highlight how the temperature affects the BP NGD responses. An innovative electrothermal calibration technique by taking into account the interconnection cable influence is developed. The electrothermal robustness analysis is carried out by variations of the NGD center frequency, cut-off frequencies and value in function of the temperature.

Keywords

Bandpass NGDelectrothermal analysisexperimentationmicrostrip circuitrobustness studyS-parameters analysistemperature effect characterization
Type
Passive Components and Circuits
Information
International Journal of Microwave and Wireless Technologies , Volume 14 , Issue 8 , October 2022 , pp. 1045 - 1053
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press in association with the European Microwave Association

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