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Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions

Published online by Cambridge University Press:  19 February 2016

Thierry Le Gouguec ,
Najib Mahdi ,
Stéphane Cadiou ,
Cédric Quendo ,
Erich Schlaffer ,
Walter Pessl  and
Alain Lefevre
Thierry Le Gouguec*
Affiliation:
Lab-STICC, Université de Brest (UBO), 6Avenue Le Gorgeu, CS 93837, BREST Cedex3, France. Phone: +33 2 98 01 72 72
Najib Mahdi
Affiliation:
Lab-STICC, Université de Brest (UBO), 6Avenue Le Gorgeu, CS 93837, BREST Cedex3, France. Phone: +33 2 98 01 72 72
Stéphane Cadiou
Affiliation:
Lab-STICC, Université de Brest (UBO), 6Avenue Le Gorgeu, CS 93837, BREST Cedex3, France. Phone: +33 2 98 01 72 72
Cédric Quendo
Affiliation:
Lab-STICC, Université de Brest (UBO), 6Avenue Le Gorgeu, CS 93837, BREST Cedex3, France. Phone: +33 2 98 01 72 72
Erich Schlaffer
Affiliation:
ATS AG, Fabriksgasse 13, 87000 Leoben, Austria
Walter Pessl
Affiliation:
ATS AG, Fabriksgasse 13, 87000 Leoben, Austria
Alain Lefevre
Affiliation:
THALES Communications Security, 4 Avenue des Louvresses, 92622 Gennevilliers Cedex, France.
*
Corresponding author: T. Le Gouguec E-mail: [email protected]
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Abstract

The recent developments in electronic cards such as the network equipment are characterized by the miniaturization of the board size and the increasing complexity of the layout. Because of these requirements, multi-layered printed circuit boards are commonly used and vias connecting signal lines on different layers, or integrated circuit devices to power and ground planes, are frequently used and often essential. However, a via is not an ideal transmission line. Besides, it creates discontinuities at high frequencies leading to high insertion loss degradation of signal which limits the performances of integrated circuit and systems. In this paper, the impacts of coupling between via and parallel-plates cavity on the response of microwave integrated devices are highlighted in the first part. Then, to describe the intrinsic interaction between the via transition and parallel-plate modes, the notion of parallel-plates matrix impedances is presented and new boundary conditions like open or plated through holes shielded boundaries of the cavities are introduced. Then, using this physics-based model, an intuitive equivalent circuit has been developed. Finally, the proposed approach and the equivalent circuits were validated by using comparisons with electromagnetic simulations and measurements in different scenarios.

Keywords

Passive Components and CircuitsModellingSimulation and characterizations of devices and circuits
Type
Research Paper
Information
International Journal of Microwave and Wireless Technologies , Volume 8 , Issue 3: Journee Nationale des Micro-ondes (JNM) 2015 , May 2016 , pp. 421 - 430
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2016 

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References

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