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Inkjet-printed paper-based substrate-integrated waveguide (SIW) components and antennas

Published online by Cambridge University Press:  16 May 2013

Riccardo Moro ,
Sangkil Kim ,
Maurizio Bozzi  and
Manos Tentzeris
Riccardo Moro*
Affiliation:
Department of Electrical, Computer and Biomedical Engineering, University of Pavia, 27100 Pavia, Italy
Sangkil Kim
Affiliation:
Georgia Institute of Technology, Atlanta, GA 30309, USA
Maurizio Bozzi
Affiliation:
Department of Electrical, Computer and Biomedical Engineering, University of Pavia, 27100 Pavia, Italy
Manos Tentzeris
Affiliation:
Georgia Institute of Technology, Atlanta, GA 30309, USA
*
Corresponding author: R. Moro Email: [email protected]
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Abstract

This paper presents a novel technology for the implementation of substrate-integrated waveguide (SIW) structures, based on a paper substrate and realized by an inkjet-printing fabrication process. The use of paper permits to implement low-cost microwave structures and components, by adopting a completely eco-friendly implementation technology. SIW structures appear particularly suitable for implementation on paper, due to the possibility to easily realize multilayered topologies and conformal geometries. In this paper, SIW passive components, and antennas (including straight interconnects, band-pass filters, and slotted-waveguide antennas) are proposed for the first time. The design of the components, the steps of the fabrication process, and the experimental characterization of the prototypes are reported in this paper.

Keywords

Substrate integrates waveguidePaper-based inkjet-printed technologyEco-friendly materialsNew and emerging technologies and materialsPassive components and circuits
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 5 , Special Issue 3: European Microwave Week 2012 , June 2013 , pp. 197 - 204
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013 

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References

REFERENCES

[1]Harrison, D.; Billett, E.; Billingsley, J.: Novel circuit fabrication techniques for reduced environmental impact, in Int. Conf. Clean Electronics Products and Technology, 1995, 174–175.Google Scholar
[2]Tentzeris, M.M.: Novel paper-based inkjet-printed antennas and wireless sensor modules, in IEEE Int. Conf. Microwaves, Communications, Antennas, Electronic Systems, 2008.Google Scholar
[3]Yang, L.; Rida, A.; Vyas, R.; Tentzeris, M.M.: RFID Tag and RF structures on a paper substrate using inkjet-printing technology. IEEE Trans. Microw. Theory Tech., 55 (12) (2007), 2894–2901.Google Scholar
[4]Vyas, R. et al. : Paper-based RFID-enabled wireless platforms for sensing applications. IEEE Trans. Microw. Theory Tech., 57 (5) (2009), 1370–1382.Google Scholar
[5]Rida, A.; Yang, L.; Vyas, R.; Tentzeris, M.M.: Conductive inkjet-printed antennas on flexible low-cost paper-based substrates for RFID and WSN applications. IEEE Antennas Propag. Mag., 51 (3) (2009), 13–23.Google Scholar
[6]Lakafosis, V.; Rida, A.; Vyas, R.; Yang, L.; Nikolaou, S.; Tentzeris, M.M.: Progress towards the first wireless sensor networks consisting of inkjet-printed, paper-based RFID-enabled sensor tags. Proc. IEEE, 98 (9) (2010), 1601–1609.Google Scholar
[7]Björninen, T.; Merilampi, S.; Ukkonen, L.; Ruuskanen, P.; Sydänheimo, L.: Performance comparison of silver ink and copper conductors for microwave applications. IET Microw., Antennas Propag., 4 (9) (2010), 1224–1231.Google Scholar
[8]Anagnostou, D.E.; Gheethan, A.A.; Amert, T.; Whites, K.W.: A low-cost WLAN “Green” PIFA antenna on eco-friendly paper substrate, in IEEE Antennas and Propagation Symp., 2009.CrossRefGoogle Scholar
[9]Deslandes, D.; Wu, K.: Single-substrate integration technique of planar circuits and waveguide filters. IEEE Trans. Microw. Theory Tech., 51 (2) (2003), 593–596.Google Scholar
[10]Bozzi, M.; Georgiadis, A.; Wu, K.: Review of substrate integrated waveguide (SIW) circuits and antennas. IET Microw. Antennas Propag., 5 (8) (2011), 909–920.Google Scholar
[11]Wu, K.: Towards system-on-substrate approach for future mm-wave and photonic wireless applications, in Asia-Pacific Microwave Conf., 2006.Google Scholar
[12]Cook, B.S.; Shamim, A.: Inkjet printing of novel wideband and high gain antennas on low-cost paper substrate. IEEE Trans. Antennas Propag., 60 (9) (2012), 4148–4156.Google Scholar
[13]Online at:. http://www.dimatix.com/Google Scholar
[14]Online at: http://www.cabot-corp.com/New-Product-Development/Printed-electronics/ProductsGoogle Scholar
[15]Kim, S.; Ren, Y.; Lee, H.; Rida, A.; Nikolaou, S.; Tentzeris, M.M.: Monopole antenna with inkjet-printed EBG array on paper substrate for wearable applications. IEEE Antennas Wirel. Propag. Lett., 11 (2012), 663–666.Google Scholar
[16]Lehmann, V.: The Electrochemistry of Silicon, John Wiley & Sons, Weinheim 2002.Google Scholar
[17]Greenstein, M.; Matta, F.: Precision vertical interconnect technology. Trans. CPMT, 14 (1991), 445–451.Google Scholar
[18]Polyakov, A. et al. : Comparison of via-fabrication techniques for through-wafer electrical interconnect applications, in Proc. 54th Electronic Components and Technology Conf., 2004,1–4 June 2004, vol. 2, 1466–1470.Google Scholar
[19]Rida, A.; Vyas, R.; Yang, L.; Kruesi, C.; Tentzeris, M.M.: Low cost inkjet-printing paper-based modules for RFID sensing and wireless applications, in European Conf. Wireless Technology, 2008 (EuWiT 2008), 27–28 October 2008, 294–297.Google Scholar
[20]Reinhold, I.; Thielen, M.; Voit, W.; Zapka, W.; Gotzen, R.; Bohlmann, H.: Inkjet printing of electrical vias, in 2011 18th European Microelectronics and Packaging Conf. (EMPC), 12–15 September 2011, 1–4.Google Scholar
[21]Lolli, F. et al. : Electromagnetic characterization of paper-glue compound for system-in-package on paper (SiPoP) future developments. IEEE Microw. Wirel. Compon. Lett., 22 (10) (2012), 545–547.Google Scholar
[22]Xu, F.; Wu, K.: Guided – wave and leakage characteristics of substrate integrated waveguide. IEEE Trans. Microw. Theory Tech., 53 (1) (2005), 66–73.Google Scholar
[23]Xu, F.; Wu, K.: Numerical multimode calibration technique for extraction of complex propagation constants of substrate integrated waveguide, in IEEE MTT-S Int. Microwave Symp., 2004.Google Scholar
[24]Mira, F.; Mateu, J.; Bozzi, M.: Substrate integrated waveguide predistorted filter at 20 GHz. IET Microw. Antennas Propag., 5 (8) (2011), 928–933.CrossRefGoogle Scholar
[25]Moro, R.; Collado, A.; Via, S.; Georgiadis, A.; Bozzi, M.: Plastic-based substrate integrated waveguide (SIW) components and antennas, in 42th European Microwave Conf. 2012 (EuMC 2012), Amsterdam, The Netherlands, October 28–November 2, 2012.Google Scholar
[26]Moro, R.; Agneessens, S.; Rogier, H.; Bozzi, M.: Wearable textile antenna in substrate integrated waveguide technology. IET Electron. Lett., 48 (16) (2012), 985–987.Google Scholar