Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Courte, Q.
Rack, M.
Nabet, M.
Cardinael, P.
and
Raskin, J.-P.
2021.
High-Temperature Characterization of Novel Silicon-Based Substrate Solutions for RF-IC Applications.
p.
187.
Rack, Martin
Nyssens, Lucas
Nabet, Massinissa
Lederer, Dimitri
and
Raskin, Jean-Pierre
2021.
Field-Effect Passivation of Lossy Interfaces in High-Resistivity RF Silicon Substrates.
p.
1.
Vandermolen, Eric
Ferrandis, Philippe
Allibert, Frédéric
Nabet, Massinissa
Rack, Martin
Raskin, Jean-Pierre
and
Cassé, Mikaël
2021.
Characterization and role of deep traps on the radio frequency performances of high resistivity substrates.
Journal of Applied Physics,
Vol. 129,
Issue. 21,
Rack, M.
Nyssens, L.
Nabet, M.
Schwan, C.
Zhao, Z.
Lehmann, S.
Herrmann, T.
Henke, D.
Kondrat, A.
Soonekindt, C.
Koch, F.
Kache, T.
Kini, D. P.
Zimmerhackl, O.
Allibert, F.
Aulnette, C.
Lederer, D.
and
Raskin, J.-P.
2022.
High-Resistivity Substrates with PN Interface Passivation in 22 nm FD-SOI.
p.
1.
Nyssens, Lucas
Rack, Martin
Schwan, Christoph
Zhao, Zhixing
Lehmann, Steffen
Hermann, Tom
Allibert, Frederic
Aulnette, Cécile
Lederer, Dimitri
and
Raskin, Jean-Pierre
2022.
Impact of substrate resistivity on spiral inductors at mm-wave frequencies.
Solid-State Electronics,
Vol. 194,
Issue. ,
p.
108377.
Nyssens, L.
Rack, M.
Nabet, M.
Schwan, C.
Zhao, Z.
Lehmann, S.
Herrmann, T.
Henke, D.
Kondrat, A.
Soonekindt, C.
Koch, F.
Kache, T.
Kini, D. P.
Zimmerhackl, O.
Allibert, F.
Aulnette, C.
Lederer, D.
and
Raskin, J.-P.
2022.
PN Junctions Interface Passivation in 22 nm FDSOI for Low-Loss Passives.
p.
1.
Courte, Q.
Rack, M.
Nabet, M.
Cardinael, P.
and
Raskin, J.-P.
2022.
High-Temperature Characterization of Multiple Silicon-Based Substrate for RF-IC Applications.
IEEE Journal of the Electron Devices Society,
Vol. 10,
Issue. ,
p.
620.
Nyssens, L.
Rack, M.
Nabet, M.
Schwan, C.
Zhao, Z.
Lehmann, S.
Herrmann, T.
Henke, D.
Kondrat, A.
Soonekindt, C.
Koch, F.
Kache, T.
Kini, D.P.
Zimmerhackl, O.
Allibert, F.
Aulnette, C.
Lederer, D.
and
Raskin, J.-P.
2023.
High-resistivity with PN interface passivation in 22 nm FD-SOI technology for low-loss passives at RF and millimeter-wave frequencies.
Solid-State Electronics,
Vol. 205,
Issue. ,
p.
108656.
Nyssens, L.
Rack, M.
Tuyaerts, R.
Lederer, D.
and
Raskin, J.-P.
2023.
Verification of Reference Impedance from Common On-Wafer Calibrations on Commercial Calibration Substrates.
p.
1.
Vanbrabant, Martin
Rack, Martin
Lederer, Dimitri
Kilchytska, Valeriya
and
Raskin, Jean-Pierre
2024.
Various RF Substrate Solutions for 22 nm FD-SOI Technology Targeting Cryogenic Applications.
p.
784.
Cardinael, Pieter
Yadav, Sachin
Hahn, Herwig
Zhao, Ming
Banerjee, Sourish
Kazemi Esfeh, Babak
Mauder, Christof
O'Sullivan, Barry
Peralagu, Uthayasankaran
Vohra, Anurag
Langer, Robert
Collaert, Nadine
Parvais, Bertrand
and
Raskin, Jean-Pierre
2024.
AlN/Si interface engineering to mitigate RF losses in MOCVD-grown GaN-on-Si substrates.
Applied Physics Letters,
Vol. 125,
Issue. 7,
Ma, Shiqi
Nabet, Massinissa
Hanus, Romain
Raskin, Jean-Pierre
Francis, Laurent A.
and
Lederer, Dimitri
2024.
Towards Porous SI THz Planar Waveguides in Ultra-Low-Resistivity Substrates.
p.
225.
Cardinael, Pieter
Yadav, Sachin
Rack, Martin
Peralagu, Uthayasankaran
Alian, Alireza
Parvais, Bertrand
Collaert, Nadine
and
Raskin, Jean-Pierre
2024.
Contribution of Substrate Harmonic Distortion to GaN-on-Si RF Switches Linearity.
IEEE Microwave and Wireless Technology Letters,
Vol. 34,
Issue. 3,
p.
298.