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Development of a mid range automotive radar sensor for future driver assistance systems

Published online by Cambridge University Press:  24 January 2013

Raik Schnabel ,
Raphael Hellinger ,
Dirk Steinbuch ,
Joachim Selinger ,
Michael Klar  and
Bernhard Lucas
Raik Schnabel*
Affiliation:
Robert Bosch GmbH, Chassis Systems Control, Daimlerstraße 6, 71226 Leonberg, Germany. Phone: +49 711-811 47493
Raphael Hellinger
Affiliation:
Robert Bosch GmbH, Chassis Systems Control, Daimlerstraße 6, 71226 Leonberg, Germany. Phone: +49 711-811 47493
Dirk Steinbuch
Affiliation:
Robert Bosch GmbH, Chassis Systems Control, Daimlerstraße 6, 71226 Leonberg, Germany. Phone: +49 711-811 47493
Joachim Selinger
Affiliation:
Robert Bosch GmbH, Chassis Systems Control, Daimlerstraße 6, 71226 Leonberg, Germany. Phone: +49 711-811 47493
Michael Klar
Affiliation:
Robert Bosch GmbH, Chassis Systems Control, Daimlerstraße 6, 71226 Leonberg, Germany. Phone: +49 711-811 47493
Bernhard Lucas
Affiliation:
Robert Bosch GmbH, Chassis Systems Control, Daimlerstraße 6, 71226 Leonberg, Germany. Phone: +49 711-811 47493
*
Corresponding author: R. Schnabel Email: [email protected]
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Abstract

Radar sensors are key components of modern driver assistance systems. The application of such systems in urban environments for safety applications is the primary goal of the project “Radar on Chip for Cars” (RoCC). Major outcomes of this project will be presented and discussed in this contribution. These outcomes include the specification of radar sensors for future driver assistance systems, radar concepts, and integration technologies for silicon-germanium (SiGe) MMICs, as well as the development and evaluation of a system demonstrator. A radar architecture utilizing planar antennas and highly integrated components will be proposed and discussed with respect to system specifications. The developed system demonstrator will be evaluated in terms of key parameters such as field of view, distance, and angular separability. Finally, as an outlook a new mid range radar (MRR) will be introduced incorporating several concepts and technologies developed in this project.

Keywords

Radar Architecture and SystemsAntenna DesignModeling and Measurements
Type
Industrial and Engineering Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 5 , Special Issue 1: Special Issue on the German RoCC Project , February 2013 , pp. 15 - 23
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013

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References

REFERENCES

[1]Hasch, J.; Topak, E.; Schnabel, R.; Zwick, T.; Weigel, R.; Waldschmidt, C.: Millimeter-wave technology for automotive radar sensors in the 77 GHz frequency band. IEEE Trans. Microwave Theory Tech., 60 (3) (2012), 845–860.Google Scholar
[2]Gresham, I. et al. : A compact manufacturable 76–77–GHz radar module for commercial ACC applications. IEEE Trans. Microwave Theory Tech., 49 (1) (2001), 44–58.Google Scholar
[3]Freundt, D.; Lucas, B.: Long range radar sensor for high-volume driver assistance systems market, in Proc. SAE World Congress and Exhibition, 2008, 117–124.Google Scholar
[4]Li, H.; Rein, H.-M.; Suttorp, T.; Böck, J.: Fully integrated SiGe VCOs with powerful output buffer for 77 GHz automotive radar systems and applications around 100 GHz. IEEE J. Solid-State Circuits, 39 (2004), 1650–1658.Google Scholar
[5]Schneider, R.; Blöcher, H.-L.; Strohm, K.M.: KOKON – automotive high frequency technology at 77/79 GHz, in European Microwave Conf., 9–12 October 2007, 1526–1529.Google Scholar
[6]Knapp, H. et al. : Sige circuits for automotive radar, in 2007 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 10–12 January 2007, 231–236.CrossRefGoogle Scholar
[7]Blöcher, H.-L.; Dickmann, J.: Automotive radar for safety and driver assistance applications: Status and trends, in Presented at the European Radar Conf. Workshop WFF01, October 2010.Google Scholar
[8]Hasch, L.; Waldschmidt, C.: In Safety for all. Presented at the European Radar Conf. Workshop WFF01, October 2010.Google Scholar
[9]Günther, O.; Steinbuch, D.; Brüggemann, O.; Jäger, H.; Weigel, R.: DC-offset compensation of a 77 GHz monostatic FMCW-radar transceiver for automotive application, in Radio and Wireless Symp., 2008 IEEE, 22–24 January 2008, 49–52.Google Scholar
[10]Forstner, H.P. et al. : A 77 GHz 4–channel automotive radar transceiver in SiGe, in Radio Frequency Integrated Circuits Symp., 2008. RFIC 2008. IEEE, 17 June 2008–17 April 2008, 233–236.Google Scholar
[11]Baur, K.; Mayer, M.; Rack, V.; Vogel, D.; Walter, T.: Angular measurements in azimuth and elevation using 77 GHz radar sensors, in Radar Conf. (EuRAD), 2010 European, 30 September–1 October 2010, 184–187.Google Scholar
[12]Budka, T.P.: Wide-bandwidth millimeter-wave bond-wire interconnects. IEEE Trans. Microwave Theory Tech., 49 (4) (2001), 715–718.Google Scholar
[13]Günther, O.: Modellierung und Leakage-Kompensation von 77 GHz FMCW-Weitbereichsradar-Transceivern in SiGe-Technologie für Kfz-Anwendungen. Ph.D. dissertation, University of Erlangen, Germany, 2008.Google Scholar
[14]Kuang, K.; Kim, F.; Cahill, S.S.: RF and Microwave Microelectronics Packaging. Springer, New York, 2010.Google Scholar
[15]Jentzsch, A.; Heinrich, W.: Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz. IEEE Trans. Microwave Theory Tech., 49 (5) (2001), 871–878.Google Scholar
[16]Brunnbauer, M. et al. : An embedded device technology based on a molded reconfigured wafer, in Proc. Electronic Components and Technology Conf., July 2006, 547–551.Google Scholar
[17]International Technology Roadmap for Semiconductors (ITRS), Millimeter Wave 10 GHz–100 GHz Technology Requirements 2010 [Online]. Available: http://www.itrs.netGoogle Scholar
[18]Wojnowski, M.; Engl, M.; Brunnbauer, M.; Pressel, K.; Sommer, G.; Weigel, R.: High frequency characterization of thin-film redistribution layers for embedded wafer level BGA, in Proc. Electronics Packaging Technology Conf., December 2007, 2007, 308–314.Google Scholar
[19]Wojnowski, M. et al. : A 77 GHz SiGe mixer in an embedded wafer level BGA package, in Proc. Electronic Components and Technology Conf., May 2008, 290–296.Google Scholar
[20]en Luan, J. et al. : Challenges for extra large embedded wafer level ball grid array development, in Electronics Packaging Technology Conf., 2009. EPTC'09, 11 December 2009, 202–207.Google Scholar
[21]Brunnbauer, M.; Meyer, T.; Ofner, G.; Mueller, K.; Hagen, R.: Embedded wafer level ball grid array (eWLB), in Electronic Manufacturing Technology Symp. (IEMT), 2008 33rd IEEE/CPMT Int., November 2008, 1–6.Google Scholar
[22]Meyer, T.; Pressel, K.; Ofner, G.; Romer, B.: System integration with eWLB, in Electronic System-Integration Technology Conf. (ESTC), 3 September 2010, 1–9.CrossRefGoogle Scholar
[23]Yoon, S.W.; Bahr, A.; Baraton, X.; Marimuthu, P.; Carson, F.: 3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3DSiP (Systems-in-Package) applications, in Electronics Packaging Technology Conf., 2009. EPTC'09, 11 December 2009, 915–919.Google Scholar
[24]Al Henawy, M.; Schneider, M.: Integrated antennas in eWLB packages for 77 GHz and 79 GHz automotive radar sensors, in European Microwave Conf., 2011, 1312–1315.Google Scholar
[25]Tamang, P.: Radar sensors. Vision Zero Int., 68–69, June 2011 [Online]. Available: http://www.scribd.com/doc/58141328/Vision-Zero-International-June-2011.Google Scholar
[26]Schnabel, R.; Mittelstrass, D.; Binzer, T.; Waldschmidt, C.; Weigel, R.: Reflection, refraction, and self-Jamming. IEEE Microwave Mag., 13 (3) (2012), 107–117, IMS special issue.Google Scholar
[27]Wagner, C. et al. : A 77 GHz automotive radar receiver in a wafer level package, In Radio Frequency Integrated Circuits Symp. (RFIC), 2012 IEEE, 17–19 June 2012, 511–514.Google Scholar
[28]Knapp, H. et al. : Three-channel 77 GHz automotive radar transmitter in plastic package, in Radio Frequency Integrated Circuits Symp. (RFIC), 2012 IEEE, 17–19 June 2012, 119–122.Google Scholar
[29]Hildebrandt, J.: 77 GHz mid range radar for a variety of applications, in Presented at the IWPC—Automotive Radar Workshop, February 2011.Google Scholar