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Published online by Cambridge University Press: 06 March 2019
The trend towards smaller devices and packages in the semiconductor industry makes it increasingly important and increasingly difficult to obtain useful X-ray diffraction information from the small areas employed. This study covers applications of a Rigaku micro-diffractometer to measure strain and obtain phase information from areas less than 100μm in diameter. Examples of residual stress mappings between electrical vias only 100μm apart and phase determination on a single electrical via 120μm diameter will be shown.