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Metal Film Thickness Standards

Published online by Cambridge University Press:  06 March 2019

Craig D. England
Affiliation:
Digital Semiconductor, 77 Reed Road, Hudson, Massachusetts 01749
Laurie Bechder
Affiliation:
Digital Semiconductor, 77 Reed Road, Hudson, Massachusetts 01749
Steve Zierer
Affiliation:
Digital Semiconductor, 77 Reed Road, Hudson, Massachusetts 01749
Lisa Gassaway
Affiliation:
Digital Semiconductor, 77 Reed Road, Hudson, Massachusetts 01749
Barbara Miner
Affiliation:
Digital Semiconductor, 77 Reed Road, Hudson, Massachusetts 01749
Steve Bill
Affiliation:
Digital Semiconductor, 77 Reed Road, Hudson, Massachusetts 01749
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Abstract

Cobalt, titanium and titanium nitride film thickness standards were deposited. All metal film thicknesses were obtained from x-ray reflectivity (XRR) measurement using a conventional powder diffractometer. The cobalt film thicknesses were also thicknesses were also determined from cross-sectional transmission electron microscopy (TEM) images and scanning electron microscope energy dispersive x-ray spectroscopy (SEM/EDXS) data using the recently developed MUFILM measurement technique. The cobalt film thicknesses obtained using MUFILM agreed well with the XRR results. The metal film standards were used to obtain calibration curves for an in-fab XRF system. The cobalt and titanium nitride film thickness standards were also used to adjust the optical constants used for an in-fab ellipsometer.

Type
Research Article
Copyright
Copyright © International Centre for Diffraction Data 1995

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References

1. Huang, T. C., Gilles, R., Will, G., Thin Solid Films, 230, 99 (1993).Google Scholar
2. Schiebl, C., Foster, L., Pfeiffer, A. and Testoni, A., Proc. of 28th annual MAS meeting, August 1-5 1994.Google Scholar