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Effects of Properties and Growth Parameters of Doped and Undoped Silicon Oxide Films on Wear Behavior During Chemical Mechanical Planarization Process
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 4 / April 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 996-1010
- Print publication:
- April 2004
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Delamination Behavior of Cu-Low-k Stack Under Different Slurries
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- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F7.3
- Print publication:
- 2003
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Effect of Tribological Properties of Undoped and Florine-Doped Silicon Di-Oxide Fims on Chemical Mechanical Planarization Process
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- Journal:
- MRS Online Proceedings Library Archive / Volume 697 / January 2001
- Published online by Cambridge University Press:
- 17 March 2011, P9.3
- Print publication:
- January 2001
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