14 results
Combine TEM with TCAD Simulation - A Novel Approach in Failure Analysis
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- Journal:
- Microscopy and Microanalysis / Volume 27 / Issue S1 / August 2021
- Published online by Cambridge University Press:
- 30 July 2021, pp. 1548-1549
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- August 2021
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Optimization of EDX Tomography Acquisition Geometry for Electronic Device Characterization
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- Microscopy and Microanalysis / Volume 26 / Issue S2 / August 2020
- Published online by Cambridge University Press:
- 30 July 2020, pp. 660-662
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- August 2020
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Innovative Grounding Methodology for Epoxy Impregnated Semiconductor Cross Sections for Electron Microscopy Inspection
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- Microscopy and Microanalysis / Volume 26 / Issue S2 / August 2020
- Published online by Cambridge University Press:
- 30 July 2020, pp. 370-372
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- August 2020
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Development of Ultra-thin TEM Lamella Preparation Technique and Its Application in Failure Analysis
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- Journal:
- Microscopy and Microanalysis / Volume 26 / Issue S2 / August 2020
- Published online by Cambridge University Press:
- 30 July 2020, pp. 1400-1402
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- August 2020
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A Case-Study of Bubble Formation Mechanism by Analytical TEM during Evaluation of an Incoming Spin-On-Hardmask at Wafer-Foundries
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- Journal:
- Microscopy and Microanalysis / Volume 25 / Issue S2 / August 2019
- Published online by Cambridge University Press:
- 05 August 2019, pp. 1784-1785
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- August 2019
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Towards Routine EDX Tomography in Semiconductor Failure Analysis
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- Journal:
- Microscopy and Microanalysis / Volume 25 / Issue S2 / August 2019
- Published online by Cambridge University Press:
- 05 August 2019, pp. 1820-1821
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- August 2019
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Advances in Elemental Electron Tomography for the State-of-the-art Semiconductor Devices and Circuits Characterization and Failure Analysis
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- Journal:
- Microscopy and Microanalysis / Volume 23 / Issue S1 / July 2017
- Published online by Cambridge University Press:
- 04 August 2017, pp. 1456-1457
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- July 2017
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How to Avoid Artifacts in Nanobeam Diffraction Strain Measurements
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- Microscopy and Microanalysis / Volume 23 / Issue S1 / July 2017
- Published online by Cambridge University Press:
- 04 August 2017, pp. 1420-1421
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- July 2017
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Characterization of VLSI Processing Defects Using STEM-EELS Tomography
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- Journal:
- Microscopy and Microanalysis / Volume 22 / Issue S3 / July 2016
- Published online by Cambridge University Press:
- 25 July 2016, pp. 280-281
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- July 2016
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Practical Considerations in Quantitative Nanoscale Energy-Dispersive X-ray Spectroscopy (EDX) and Its Application in SiGe
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- Journal:
- Microscopy and Microanalysis / Volume 21 / Issue S3 / August 2015
- Published online by Cambridge University Press:
- 23 September 2015, pp. 1087-1088
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- August 2015
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Effect of TaN Stoichiometry on Barrier Oxidation and Defect Density in 32nm Cu/Ultra-Low K Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-F01-02
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- 2010
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From Process Assumptions to Development to Manufacturing
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1079 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1079-N02-01
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- 2008
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A Closer “Look” at Modern Gate Oxides
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- Journal:
- MRS Online Proceedings Library Archive / Volume 611 / 2000
- Published online by Cambridge University Press:
- 14 March 2011, C4.1.1
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- 2000
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Numerical Simulations of Topographic Evolution for Sputter Deposition into Trenches and Vias
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- Journal:
- MRS Online Proceedings Library Archive / Volume 564 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 313
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- 1999
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