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1 - Introduction to Electromigration
Paul S. Ho, University of Texas, Austin, Chao-Kun Hu, Martin Gall, Valeriy Sukharev
Book:

Electromigration in Metals

Published online:

05 May 2022

Print publication:

12 May 2022, pp 1-7
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Summary

This chapter provides an overview of electromigration in metals, starting from the early studies on bulk metals to the current studies on copper interconnects. Asmicroelectronics technology advances, electromigration becomes an important reliability problem for on-chip interconnects, evolving from the microscale to the nanoscale in copper lines. Key concepts are introduced, including the electron wind force, the Blech short-length effects, and copper damascene interconnects.