GaN/sapphire layers have been grown by Metal Organic Vapour Phase Epitaxy (MOVPE). An amorphous silicon nitride layer is deposited using a SiH4/NH3 mixture prior to the growth of the low temperature GaN buffer layer. Such a process induces a 3D nucleation at the early beginning of the growth, resulting in a kind of maskless ELO process with random opening sizes. This produces a significant decrease of the threading dislocation (TD) density compared to the best GaN/sapphire templates. Ultra Low Dislocation density (ULD) GaN layers were obtained with TD density as low as 7×107cm−2 as measured by atomic force microscopy (AFM), cathodoluminescence and transmission electron microscopy (TEM). Time-resolved photoluminescence experiments show that the lifetime of the A free exciton is principally limited by capture onto residual donors, similar to the situation for nearly dislocation-free homoepitaxial layers.

Gallium nitride films are grown by plasma-assisted molecular beam epitaxy (MBE) on 6H-SiC(0001) substrates with no miscut and with 3.5° miscuts in both the [1 0 0] and [1 1 0] directions. The hydrogen-etched substrates display straight or chevron shaped steps, respectively, and the same morphology is observed on the GaN films. X-ray rocking curves display substantially reduced width for films on the vicinal substrates compared to singular substrates, for the same Ga/N flux ratio used during growth.

A systematic investigation of damage accumulation in GaN films induced by Ar+ as a function of implantation temperature and dose rate has been conducted. Depth distribution of disorder was measured by Rutherford Backscattering/Channeling spectrometry. Two disordered regions were identified in the damage depth distribution: a surface peak and a bulk damage peak. These regions exhibited different behavior as a function of implantation temperature. The displaced atomic density in the bulk damage peak displayed a “reverse annealing” behavior in temperature range from 500 °C to 700 °C, which we attributed to formation of characteristic secondary defects. The influence of implantation temperature and dose rate on the radiation damage accumulation is discussed.

Differential Hall-effect measurements are used to obtain profiles of the mobility, μ, and carrier concentration, n, in a 6-μm-thick GaN layer grown on Al2O3 by hydride vapor phase epitaxy (HVPE). In the top 1-μm region (surface), μ ≈ 1000 cm2/V-s and n ≈ 3 × 1016 cm−3, whereas in the bottom 0.75-μm region (interface), μ ≈ 50 cm2/V-s and n ≈ 2 × 1019 cm−3. Throughout the layer, the carrier concentration correlates well with the O and Si concentrations, with [Si] dominant near the surface, and [O] dominant near the interface, proving the shallow-donor nature of O. The average mobility and carrier concentration in the top 5 μm, i.e., the “bulk” region, are close to the values deduced by a much simpler analysis, introduced previously.

We report the growth of high quality GaN epitaxial layers by rf-plasma MBE. The unique feature of our growth process is that the GaN epitaxial layers are grown on top of a double layer that consists of an intermediate-temperature buffer layer (ITBL), which is grown at 690°C and a conventional low-temperature buffer layer deposited at 500°C. It is observed that the electron mobility increases steadily with the thickness of the ITBL, which peaks at 377 cm2V−1s−1 for an ITBL thickness of 800 nm. The PL also demonstrated systematic improvements with the thickness of the ITBL. Our analyses of the mobility and the photoluminescence characteristics demonstrate that the utilization of an ITBL in addition to the conventional low-temperature buffer layer leads to the relaxation of residual strain within the material resulting in improvement in the optoelectronic properties of the films. A maximum electron mobility of 430 cm2V−1s−1 can be obtained using this technique and further optimizing the growth conditions for the low-temperature buffer layer.

The presence of piezoelectric fields within p-i-n GaN/InGaN multiple quantum well structures is discussed. Time integrated and time-resolved photoluminescence measurements and theoretical calculations of the effect of these fields is presented. Furthermore, a description of how these fields influence the carrier dynamics and a discussion of how the piezoelectric field effects the design of GaN/InGaN devices is presented.

Lateral epitaxial overgrowth (LEO) on Si(111) substrates using an AlN buffer layer is demonstrated and characterized using scanning electron microscopy, atomic force microscopy, transmission electron microscopy, x-ray diffraction, photoluminescence spectroscopy, and cathodoluminescence imaging. The <100>-oriented LEO GaN stripes grown on silicon substrates are shown to have similar structural properties as LEO GaN grown on GaN/Al2O3 substrates: the surface topography is characterized by continuous crystallographic steps rather than by steps terminated by screw-component threading dislocations; the density of threading dislocations is <106 cm−2; the LEO regions exhibit crystallographic tilt (0.7-4.7°) relative to the seed region. The AlN buffer thickness affects the stripe morphology and, in turn, the microstructure of the LEO GaN. The issues of chemical compability and thermal expansion mismatch are discussed.