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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints
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- Journal:
- Journal of Materials Research / Volume 26 / Issue 3 / 14 February 2011
- Published online by Cambridge University Press:
- 11 February 2011, pp. 467-474
- Print publication:
- 14 February 2011
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- Article
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