8 results
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
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- Journal:
- Journal of Materials Research / Volume 24 / Issue 2 / February 2009
- Published online by Cambridge University Press:
- 31 January 2011, pp. 534-543
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- February 2009
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Undercooling and microhardness of Pb-free solders on various under bump metallurgies
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- Journal:
- Journal of Materials Research / Volume 23 / Issue 4 / April 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1147-1154
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- April 2008
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Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
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- Journal:
- Journal of Materials Research / Volume 22 / Issue 3 / March 2007
- Published online by Cambridge University Press:
- 03 March 2011, pp. 557-560
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- March 2007
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Layered Compound Semiconductor GaSe and GaTe Crystals for THz Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 969 / 2006
- Published online by Cambridge University Press:
- 26 February 2011, 0969-W03-15
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- 2006
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The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 6 / June 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 1608-1612
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- June 2004
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Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
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- Journal:
- Journal of Materials Research / Volume 17 / Issue 11 / November 2002
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2775-2778
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- November 2002
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Nickel-alloyed tin-lead eutectic solder for surface mount technology
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- Journal:
- Journal of Materials Research / Volume 8 / Issue 5 / May 1993
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1033-1040
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- May 1993
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The Slope Etching of a-Si:H Film using CF4 + O2 Gas
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- Journal:
- MRS Online Proceedings Library Archive / Volume 219 / 1991
- Published online by Cambridge University Press:
- 21 February 2011, 811
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- 1991
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