13 results
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 6 / June 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 1608-1612
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- June 2004
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Stress-Voiding and Electromigration in Multilevel Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 411
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- 1995
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The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 197
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- 1995
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Stress-Voiding and Electromigration in Multilevel Interconnect Metallizations
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- Journal:
- MRS Online Proceedings Library Archive / Volume 337 / 1994
- Published online by Cambridge University Press:
- 25 February 2011, 527
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- 1994
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Predicting and Comparing Electromigration Failure for Different Test Structures
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- Journal:
- MRS Online Proceedings Library Archive / Volume 338 / 1994
- Published online by Cambridge University Press:
- 22 February 2011, 435
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- 1994
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The Effect of Thermally Induced Stresses on Electromigration Lifetime Of Near-Bamboo Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 121
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- 1993
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Analysis of Thermal Stress Induced Void Growth During Thermal Cycling
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- Journal:
- MRS Online Proceedings Library Archive / Volume 308 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 291
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- 1993
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Analysis of Thermal Stress Induced Void Growth During Thermal Cycling
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 223
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- 1993
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Mechanisms of Stress-Induced and Electromigration-Induced Damage in Passivated Narrow Metallizations on Rigid Substrates
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- Journal:
- MRS Bulletin / Volume 17 / Issue 7 / July 1992
- Published online by Cambridge University Press:
- 29 November 2013, pp. 61-69
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- July 1992
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Residual stress measurements of thin aluminum metallizations by continuous indentation and x-ray stress measurement techniques
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- Journal:
- Journal of Materials Research / Volume 6 / Issue 10 / October 1991
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2084-2090
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- October 1991
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Mechanisms of Inelastic Deformation and Stress Relaxation in Thin Metallizations Bonded to Hard Substrates
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- Journal:
- MRS Online Proceedings Library Archive / Volume 226 / 1991
- Published online by Cambridge University Press:
- 26 February 2011, 391
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- 1991
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Void Growth as a Function of Residual Stress Level in Thin, Narrow Aluminum Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 226 / 1991
- Published online by Cambridge University Press:
- 26 February 2011, 413
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- 1991
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Application of a New Solid State X-Ray Camera to Stress Measurement
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- Journal:
- Advances in X-ray Analysis / Volume 32 / 1988
- Published online by Cambridge University Press:
- 06 March 2019, pp. 407-413
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- 1988
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