Hostname: page-component-78c5997874-94fs2 Total loading time: 0 Render date: 2024-11-10T06:47:36.309Z Has data issue: false hasContentIssue false
  • English
  • Français

Combining FIB and Automated Microcleaving Provides Fast, Accurate Cross Sections

Published online by Cambridge University Press:  14 March 2018

Janet Teshima
Janet Teshima*
Affiliation:
FEI Company & Efrat Raz, SELA USA, Inc.

Extract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

A large part of the preparation of semiconductor samples for SEM and TEM observations involves the creation of cross sections to expose subsurface defects and three-dimensional structure. A powerful new combination of FIB (FEI Company, Hillsboro, Oregon, http://www.feic.com ) with automated microcleaving technology (SELA, Santa Clara, California, http://www. sela.com ) now offers a comprehensive solution for fast, easy and accurate sample preparation.

Type
Research Article
Information
Microscopy Today , Volume 7 , Issue 7 , September 1999 , pp. 34 - 35
Copyright
Copyright © Microscopy Society of America 1999