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Thermal Fatigue and Failure Analysis of Cu-Plated Through Hole Solder Joints

Published online by Cambridge University Press:  26 July 2009

DF Susan ,
AC Kilgo ,
PT Vianco  and
MK Neilsen
DF Susan
Affiliation:
Sandia National Laboratories
AC Kilgo
Affiliation:
Sandia National Laboratories
PT Vianco
Affiliation:
Sandia National Laboratories
MK Neilsen
Affiliation:
Sandia National Laboratories

Extract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009

Type
Abstract
Information
Microscopy and Microanalysis , Volume 15 , Supplement S2 , July 2009 , pp. 26 - 27
Copyright
Copyright © Microscopy Society of America 2009