Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-02T19:22:34.106Z Has data issue: false hasContentIssue false
  • English
  • Français

In-situ TEM Characterization of Ultra-robust Memristors Based on Fully Layered Two-dimensional Materials

Published online by Cambridge University Press:  01 August 2018

Songhua Cai ,
Miao Wang ,
Xiaoqing Pan ,
J. Joshua Yang ,
Feng Miao  and
Peng Wang
Songhua Cai
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Miao Wang
Affiliation:
School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Xiaoqing Pan
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. Department of Chemical Engineering and Materials Science and Department of Physics and Astronomy, University of California, Irvine, CA, USA.
J. Joshua Yang
Affiliation:
Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, USA.
Feng Miao
Affiliation:
School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Peng Wang
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 1886 - 1887
Copyright
© Microscopy Society of America 2018 

References

[1] Chua, L IEEE Trans. Circuit Theory 18 1971) p. 507.Google Scholar
[2] Yang, J, Strukov, D Stewart, D Nat. Nanotechnol. 8 2013) p. 13.Google Scholar
[3] Wang, M, et al, Nature Electronic 2018 https://doi.org/10.1038/s41928-018-0021-4.Google Scholar
[4] Helveg, S, et al, Phys. Rev. Lett. 84 2000) p. 5.Google Scholar