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In-situ TEM Characterization of Ultra-robust Memristors Based on Fully Layered Two-dimensional Materials

Published online by Cambridge University Press:  01 August 2018

Songhua Cai
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Miao Wang
Affiliation:
School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Xiaoqing Pan
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China. Department of Chemical Engineering and Materials Science and Department of Physics and Astronomy, University of California, Irvine, CA, USA.
J. Joshua Yang
Affiliation:
Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, USA.
Feng Miao
Affiliation:
School of Physics, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
Peng Wang
Affiliation:
National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.

Abstract

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Type
Abstract
Copyright
© Microscopy Society of America 2018 

References

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