This paper presents a novel assessment method that minimizes test-fixture-induced errors in non-coaxial power combiner measurement by extending the port reduction method. This method involves terminating certain ports to acquire the scattering matrix of an N-port network from the scattering matrix measured at a reduced port order. The entire DUT scattering matrix is obtained from multiple scanning measurements, which are taken from partial coaxial accessible ports, based on a set of configurable terminating states. This advantage is leveraged to exclude a major portion of coaxial launch structures that would otherwise be incorporated in the conventional multiport test fixture. An analogous concept here is applied to measure a waveguide traveling-wave power combiner. A sandwiched twin structure, containing a divider/combiner pair with certain auxiliary through-type components cushioned between them, is utilized to assess the combiner characteristics. A theoretical framework of the proposed method was established to test its potential precision. Thereafter, an in-situ implementation was conducted to test its practical application on a traveling-wave combined amplifier prototype operating at the Q-band (33–39 GHz).

A simple method for the full characterization of passive n-port microwave monolithic integrated circuit (MMIC) structures using standard two-port vector network analyzer (VNA) measurements is presented. Its main advantages are: it does not require to perform measurements from all the ports of the network, no special calibration procedure is needed, the auxiliary terminations required by the procedure can be integrated at the border of the structure under test with minimal area increase, and it can be easily implemented in commercial CAD software. The method was applied to a nine-port microstrip structure corresponding to the output power combiner and impedance matching network of an X-band MMIC high power amplifier (HPA). The full S-parameter matrix was derived from two-port measurements and compared to the circuit–as well as electromagnetic (EM)-based simulations of the structure.