6 results
Electrochemical and Material Study of Electroless Ternary Barriers for Copper Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 433
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- 1998
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Electroless CoWP Barrier/Protection Layer Deposition for Cu Metallization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 451 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 463
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- 1996
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Sub-Half Micron Electroless Cu Metallization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 179
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- 1996
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Nanometer-Scale Oxide Particles in Gesi Films Grown by Wet Oxidation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 321 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 615
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- 1993
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The Formation of TiN-Encapsulated Cu Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 260 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 605
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- 1992
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Ion-Implantation Effects on Spin-on-Glass (Sol-Gel) SiO2 Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 180 / 1990
- Published online by Cambridge University Press:
- 28 February 2011, 703
- Print publication:
- 1990
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