8 results
PP47 Experience And Its Implication For Reassessment Of The Transcatheter Aortic Valve Implantation Using Real World Data
-
- Journal:
- International Journal of Technology Assessment in Health Care / Volume 39 / Issue S1 / December 2023
- Published online by Cambridge University Press:
- 14 December 2023, pp. S64-S65
-
- Article
-
- You have access
- Export citation
PP84 Evaluation Of The Evidence Level Of Scrambler Therapy For Musculoskeletal Pain Relief: A Systematic Literature Review
-
- Journal:
- International Journal of Technology Assessment in Health Care / Volume 39 / Issue S1 / December 2023
- Published online by Cambridge University Press:
- 14 December 2023, p. S74
-
- Article
-
- You have access
- Export citation
Paliperidone in the treatment of delirium: results of a prospective open-label pilot trial
-
- Journal:
- Acta Neuropsychiatrica / Volume 23 / Issue 4 / August 2011
- Published online by Cambridge University Press:
- 24 June 2014, pp. 179-183
-
- Article
- Export citation
Cardiac cell therapy with mesenchymal stem cell induces cardiac nerve sprouting, angiogenesis, and reduced connexin43-positive gap junctions, but concomitant electrical pacing increases connexin43-positive gap junctions in canine heart
-
- Journal:
- Cardiology in the Young / Volume 20 / Issue 3 / June 2010
- Published online by Cambridge University Press:
- 29 March 2010, pp. 308-317
-
- Article
- Export citation
Deposition and Characteristics of Tantalum Nitride films by Plasma Assisted Atomic Layer Deposition as Cu Diffusion Barrier
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 766 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, E3.22
- Print publication:
- 2003
-
- Article
- Export citation
Grain Morphology of Intermetallic Compounds at Solder Joints
-
- Journal:
- Journal of Materials Research / Volume 17 / Issue 3 / March 2002
- Published online by Cambridge University Press:
- 31 January 2011, pp. 597-599
- Print publication:
- March 2002
-
- Article
- Export citation
Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint
-
- Journal:
- Journal of Materials Research / Volume 17 / Issue 1 / January 2002
- Published online by Cambridge University Press:
- 31 January 2011, pp. 43-51
- Print publication:
- January 2002
-
- Article
- Export citation
Reliability of Electrodeposited Copper and Ecrcvd Siof Films for Multilevel Metallization
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 565 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 93
- Print publication:
- 1999
-
- Article
- Export citation