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Published online by Cambridge University Press: 11 February 2011
Ti/Ni/Au/diamond metal-insulator-semiconductor field effect transistors with TiO2 gate dielectric have been successfully fabricated. In this work, multi-layer metallization on the semiconducting diamond surface was investigated. Post-metallization annealing was performed and EDS analysis was conducted both before annealing and after annealing. Elevated temperature annealing accelerates the diffusion between multi-layer metal and lowers the ohmic contact resistance of the interface. Current-voltage characteristics of the transistor are reported.