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TEM Observation of Nanocrystalline Copper During Deformation

Published online by Cambridge University Press:  14 March 2011

Carl J. Youngdahl
Affiliation:
Northwestern University, Evanston, IL 60208, USA
Richard C. Hugo
Affiliation:
Los Alamos National Laboratory, Los Alamos, NM 87545, USA
Harriet Kung
Affiliation:
Los Alamos National Laboratory, Los Alamos, NM 87545, USA
Julia R. Weertman
Affiliation:
Northwestern University, Evanston, IL 60208, USA

Abstract

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Nanocrystalline samples of copper were prepared using inert gas condensation and an optimized sequence of powder outgassing and compaction. TEM specimens were cut, electropolished, and mounted in a straining stage. In situ TEM observations including real-time video were captured during straining in the microscope. Areas of presumed increased stress concentration were identified near small cracks around the perimeter of the electropolished hole. Such locations were observed in the TEM while the specimen was pulled in tension. Several microstructural changes were captured during deformation including numerous sudden shifts in contrast of grains and parts of grains, occasional dislocation motion, opening and propagation of the crack. Relationships between grain size and deformation are described.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

References

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