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On Relating Thermodynamic Work of Adhesion to Interfacial Fracture Toughness

Published online by Cambridge University Press:  10 February 2011

Raymond A. Pearson  and
Thomas B. Lloyd
Raymond A. Pearson
Affiliation:
Materials Research Center, Microelectronics Packaging Materials Laboratory, Lehigh University Bethlehem, PA 18015, USA [email protected]
Thomas B. Lloyd
Affiliation:
Materials Research Center, Microelectronics Packaging Materials Laboratory, Lehigh University Bethlehem, PA 18015, USA [email protected]
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Abstract

Organic adhesives are commonly used in the microelectronics industry to bond silicon chips to a wide variety of substrates. The substrates include copper, silver, nickel / palladium, polyimide, and glass‐filled epoxies. The surfaces of these substrates are affected by the processing steps used in the manufacturing process used to produce the final package. The most common adhesives used in the assembly of microelectronic packages are epoxy‐based and there are numerous grades and types to chose from. Therefore, the packaging engineer is faced with the dilemma of what criterion to use to select the best adhesive for a particular package design.

At the crux of the problem is how does one predict adhesion and how does one measure it? It is proposed that the surfaces play an important role in forming the interfacial bond and that strength of the mating surfaces can be characterized in terms of the thermodynamic work of adhesion. Roughness is also a factor but will not be dealt with here. The thermodynamic work of adhesion describes the energy to reversibly separate two surfaces (elastic). Interfacial fracture mechanics may be used to quantify the strain energy release rate for separating two surfaces and contains both elastic and inelastic contributions. This talk will contain a discussion of our studies on the use of a three liquid probe method to determine the thermodynamic work of adhesion and a mixed‐mode bending method to measure interfacial fracture toughness. Moreover, we will comment on the perils of relating the thermodynamic work of adhesion to the interfacial fracture toughness.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 247
Copyright
Copyright © Materials Research Society 1997

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