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Multiple Layers of Copper Thin Films of Alternating Textures

Published online by Cambridge University Press:  11 February 2011

Hanchen Huang ,
H. L. Wei ,
H. Y. Liang ,
C. H. Woo  and
X. X. Zhang
Hanchen Huang*
Affiliation:
Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180
H. L. Wei
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
H. Y. Liang
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
C. H. Woo
Affiliation:
Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong
X. X. Zhang
Affiliation:
Department of Physics, Hong Kong University of Science and Technology, Hong Kong
*
* (email: [email protected])
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Abstract

In this paper, we present a preliminary study of texture development during copper thin film deposition. Using direct current (DC) magnetron sputtering technique, we deposit copper films on a SiO2/Si(111) substrate. A thin layer of copper of <111> texture first develops, and another thin layer of <110> ensues. As deposition continues, a third layer of copper of <111> texture forms on the top, leading to a copper thin film of alternating <111> and <110> textures. The multiple layers of copper thin films of alternating textures form during continuous deposition without changing deposition conditions. The film morphology is characterized with scanning electron microscopy (SEM) and atomic force microscopy (AFM), and the texture with X-ray diffraction (XRD). Based on anisotropic elastic analyses and molecular dynamics simulations, we propose a model of texture evolution during the formation of multilayers, attributing the texture evolution to the competition of surface and strain energies.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 750: Symposium Y – Surface Engineering 2002–Synthesis, Characterization and Applications , 2002 , Y9.10
Copyright
Copyright © Materials Research Society 2003

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References

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