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Published online by Cambridge University Press: 15 February 2011
Cluster-assembled thin metal films exhibit properties which are different from those of films obtained by conventional atomic-deposition. We present TEM data on the evolution of 2-D Microstructure and SFM data on the evolution of 3-D Microstructure in thin films grown by vacuum deposition of preformed silver clusters and of preformed acetylene-silver clusters on flat SiO2, and Mica. Electrical resistivity measurements of cluster-based Ag and Ag/C2H2 films deposited on glass substrates with nominal film thicknesses of 5 nm - 50 nm are also presented and discussed.