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Manufacturing of 3-D Microstructures Using Novel Upsams Process for Mems Applications

Published online by Cambridge University Press:  11 February 2011

André Sharon
Affiliation:
Department of Manufacturing Engineering and Fraunhofer USA Center for Manufacturing, Innovation, Boston University, 15 Saint Mary's Street, Brookline, MA 02446, USA
Axel Bilsing
Affiliation:
Department of Manufacturing Engineering and Fraunhofer USA Center for Manufacturing, Innovation, Boston University, 15 Saint Mary's Street, Brookline, MA 02446, USA
Gordon Lewis
Affiliation:
Department of Manufacturing Engineering and Fraunhofer USA Center for Manufacturing, Innovation, Boston University, 15 Saint Mary's Street, Brookline, MA 02446, USA
Xin Zhang
Affiliation:
Department of Manufacturing Engineering and Fraunhofer USA Center for Manufacturing, Innovation, Boston University, 15 Saint Mary's Street, Brookline, MA 02446, USA
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Abstract

This paper introduces a new microfabrication technique, Ultraprecision Manufacturing of Self-Assembled Micro-Systems (UPSAMS), which combines ultraprecision micromachining (milling/turning/drilling/grinding) with sacrificial/structural multi-layer manufacturing processes to produce self-assembled, 3-D microsystems and associated mesoscale interfaces from a variety of materials for MEMS applications. With this process, a new class of microsystems can be developed that is highly three dimensional, precisely machined, and automatically assembled.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCE

1. Weck, M., Fischer, S., Vos, M., “Fabrication of Microcomponents Using Ultraprecision Machine Tools”, Nanotechnology, (8): 145148, 1997.Google Scholar