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High-Resolution Electron Microscopy of Interfaces In Ain - Braze Metal Alloy Systems

Published online by Cambridge University Press:  25 February 2011

A. H. Carim
A. H. Carim*
Affiliation:
Center for Micro-Engineered Ceramics & Department of Chemical and Nuclear EngineeringUniversity of New Mexico, Albuquerque, NM 87131
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Abstract

The microstructural aspects of active brazing of AIN with a Ag-Cu-Ti alloy have been investigated. A series of reaction product layers are formed. TiN is produced in contact with the polycrystalline, bulk AIN. High-resolution transmission electron microscopy and microdiffraction demonstrate that some of the TiN grains at the interface display specific orientation relationships with respect to the adjoining AIN crystallites. As has sometimes been observed in studies of epitaxy in other systems, these relationships are not necessarily those that provide the minimum geometrical mismatch between one or more sets of lattice planes. Farther from the substrate, an fl-type nitride phase with composition (Ti,Cu,Al)6N occurs as a reaction product. High-resolution images confirm the absence of amorphous or crystalline intervening phases at the TiN-ŋ interface and at ŋ grain boundaries.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 159: Symposium C – Atomic Scale Structure of Interfaces , 1989 , 425
Copyright
Copyright © Materials Research Society 1990

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References

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