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Hardness and Adhesion Measurements of Copper Metallizations by a Continuous Indentation Approach
Published online by Cambridge University Press: 25 February 2011
Abstract
A continuous indentation test has been used to evaluate the difference in adhesion between copper films deposited on oxidized silicon substrates with different transition metalinterlayers. Variations in adhesion between samples with interlayers of Al,Cr,Ni,Ti and V correlated with the free energy of formation of the particular metal oxide present.
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- Copyright © Materials Research Society 1991
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