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Grain-Size Stability and Microhardness of Copper-Fullerene Nanocomposites

Published online by Cambridge University Press:  15 February 2011

R.L. Holtz ,
E.V. Barrera ,
J. Milliken  and
V. Provenzano
R.L. Holtz
Affiliation:
Geo-Centers, Inc., 10903 Indian Head Hwy., Ft. Washington, MD 20744
E.V. Barrera
Affiliation:
Department of Materials Science, Rice University, Houston, TX 77251
J. Milliken
Affiliation:
Chemistry Division, Code 6120, Naval Research Laboratory, Washington, DC 20375
V. Provenzano
Affiliation:
Materials Science and Technology Division, Code 6370, Naval Research Laboratory, Washington, DC 20375
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Abstract

Nanocomposites of copper with low concentrations of dispersed fullerenes were synthesized by simultaneous sputtering of copper and sublimation of fullerenes. Postdeposition heat treatments at 400 and 800 °C were performed to assess the thermal stability of the microstructure and the effect on the Vicker's microhardness. The as-deposited copperfullerene composite has submicron-scale granularity, in contrast to pure copper which has conventional columnar growth. Grain growth in the heat-treated fullerene-containing specimens is suppressed and the microhardness enhanced relative to pure copper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 351: Symposium V – Molecularly Designed Ultrafine/Nanostructured Materials , 1994 , 375
Copyright
Copyright © Materials Research Society 1994

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References

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