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Geometric Characterization of Electromigration Voids

Published online by Cambridge University Press:  22 February 2011

Yolanda J. Kime  and
Peter Grach
Yolanda J. Kime
Affiliation:
State University of New York at Cortland, Physics Department, Cortland, NY 13045
Peter Grach
Affiliation:
State University of New York at Cortland, Physics Department, Cortland, NY 13045
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Abstract

The areas, perimeters, lengths, and widths of 998 electromigration induced voids on 38 test stripes have been measured by SEM and digital image analysis. Virtually all of the voids occurred along the passivation-conductor interface on the side of the stripe. Plots of number of voids or total void area versus time to failure do not extrapolate to zero voids at zero time to failure which suggests there is a certain number of active nucleation sites predisposed to voiding.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 255
Copyright
Copyright © Materials Research Society 1994

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References

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