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GaAs Circuit Restructuring by Multi-Level Laser-Direct-Written Tungsten Process
Published online by Cambridge University Press: 28 February 2011
Abstract
Laser-direct-writing processes are employed to fabricate a GaAs digital integrated circuit. The lithography-free techniques deposit and etch conductors and resistors, and remove insulating layers, thus enabling multilevel interconnections. These combined directwrite processes provide the flexibility of clip-lead prototyping on a micrometer scale.
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