Hostname: page-component-7bb8b95d7b-qxsvm Total loading time: 0 Render date: 2024-09-16T06:31:19.685Z Has data issue: false hasContentIssue false

Electron Cyclotron Resonance in Strained Si and Si0.94Ge0.06 Channels on Relaxed Si0.62Ge0.38 Buffers Grown by Rapid Thermal Chemical Vapor Deposition

Published online by Cambridge University Press:  10 February 2011

C. W. Liu
Affiliation:
National Chunghsing University, Dept. of Electrical Engineering, Taichung, Taiwan
V. Venkataramana
Affiliation:
Indian Institute of Science, Bangalore, Dept. of Physics, India
Get access

Abstract

We report the far-infrared measurements of the electron cyclotron resonance absorption in n-type Si/Si0. 62Ge0.38 and Si0.94Ge0.06 /Si0. 62Ge0.38 modulation- doped heterostructures grown by rapid thermal chemical vapor deposition. The strained Si and Si0.94Ge0.06 channels were grown on relaxed Si0.62Ge0.38 buffer layers, which consist of 0.6 μm uniform Si0.62Ge0.38 layers and 0.5 μm compositionally graded relaxed SiGe layers from 0% Ge to 38 % Ge. The buffer layers were annealed at 800 °C for 1 hr to obtain complete relaxation. The samples had 100 Å spacers and 300 Å 2×1019 cm-3 n-type supply layers on the tops of the 75 Å channels. The far-infrared measurements of electron cyclotron resonance were performed at 4K with the magnetic field of 4 – 8 Tesla. The effective masses determined from the slope of center frequency of absorption peak vs applied magnetic field plot are 0.20 mo and 0.19 mo for the two dimensional electron gases in the Si and Si0.94Ge0.06 channels, respectively. The Si effective mass is very close to that of two dimensional electron gas in Si MOSFET (0.198mo). The electron effective mass of Si0.94Ge0.06 is reported for the first time and about 5 % lower than that of pure Si.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Crabbe, E., Meyerson, B. S., Stork, J. M. C., and Harame, D. L., Tech. Dig. Int. Elec. Dev. Mtg. 83 (1993).Google Scholar
2. Schuppen, A., Erben, U., Gruhle, A., Kibbel, H., Schumacher, H., and Konig, U., Tech. Dig. Int. Elec. Dev. Mtg. 743 (1995).Google Scholar
3. Ismail, K., Arafa, M., Saenger, K. L., Chu, J. O., and Meyerson, B. S., Appl. Phys. Lett. 66, 1077 (1995).Google Scholar
4. Xie, Y. H., Monroe, Don, Fitzgerald, E. A., Silverman, P. J., Thiel, F. A., and Watson, G. P., Appl. Phys. Lett. 63, 2263 (1993).Google Scholar
5. Whall, T. E., Plews, A. D., Mattey, N. L., and Parker, E. H. C. Appl. Phys. Lett. 65, 3362 (1994).Google Scholar
6. Kotthaus, J. P., Abstreiter, G., Koch, J. F., and Ranvaud, R., Phys. Rev. Lett. 34, 151 (1975).Google Scholar
7. Murphy, S. Q., Schlesinger, Z., Nelson, S. F., Chu, J. O., and Meyerson, B. S., Appl. Phys. Lett., 63, 222 (1993).Google Scholar
8. van de Walle, C. G. and Martin, R., Phys. Rev. B. 34, 5621 (1986).Google Scholar
9. LeGoues, F. K., Meyerson, B. S., Morar, J. F., and Kirchner, P. D., J. Appl. Phys. 71, 4230 (1992).Google Scholar
10. Venkataraman, V., Liu, C. W., and Sturm, J. C., J. Vac. Sci. Tech. B11, 1176 (1993).Google Scholar
11. Jaffe, M. and Singh, J., J. Appl. Phys., 65, 329 (1989).Google Scholar