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Effect of Surface Chemistry on the diffusion of Copper in nanoporous dielectrics
Published online by Cambridge University Press: 17 March 2011
Abstract
This work is aimed at understanding the nature of the interactions between metal interconnects and nanoporous dielectrics in integrated circuits. Electrical testing of MIS capacitors is used to assess Cu diffusion and charge injection in the dielectric in the presence of an electric field. We have found that surface modification of nanoporous silica reveals the importance of chemically bound or adsorbed water species in the dielectric and how they trigger metal diffusion. We propose that a combination of moisture-related species in the dielectric and interfacial oxygen oxidize Cu. The copper oxide acts as a source for Cu ions available for diffusion. A quantitative analysis of Cu drift in nanoporous dielectrics that shows the importance of surface chemistry is presented and the mechanism of metal diffusion and charge injection in nanoporous dielectrics is discussed.
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- Copyright © Materials Research Society 2004