Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-12-01T00:33:06.151Z Has data issue: false hasContentIssue false
  • English
  • Français

The Effect of Deposition Parameters on Tensile Properties of Pulse-Plated Nanocrystalline Nickel

Published online by Cambridge University Press:  14 March 2011

K. L. Morgan ,
Z. Ahmed  and
F. Ebrahimi
K. L. Morgan
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, U.S.A
Z. Ahmed
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, U.S.A
F. Ebrahimi
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, U.S.A
Get access

Abstract

The microstructure and tensile properties were investigated for pulse-plated nanocrystalline nickel electrodeposits prepared from an additive-free sulfamate-based solution. Square-wave cathodic current densities were varied from 25 to 75 mA/cm2. The samples deposited at 25 mA/cm2 showed the smallest grain size (d ∼ 12 nm), and the grain size was found to increase with increasing current densities. The grain size of the electrodeposits ranged from approximately 27 to 12 nm. Tensile results indicated that the yield strength of the specimens increased with decreasing grain size. Scanning electron microscopy revealed that all electrodeposits fractured through a ductile mechanism.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 634: Symposium B – Structure and Mechanical Properties of Nanophase Materials-Theory & Computer Simulations vs. Experiment , 2000 , B3.11.1
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ebrahimi, F., Kong, D., Matthews, T. E., and Zhai, Q., in Processing and Fabrication of Advanced Materials VII, edited by Srivastan, T.S. and Khor, K. A. (TMS Publication, Warrendale, PA, 1998), p. 509.Google Scholar
2. El-Sherik, A. M. and Erb, U., J. Mater. Sci. 30, 5743 (1995).Google Scholar
3. Ebrahimi, F., Bourne, G. R., Kelly, M. S., and Matthews, T. E., NanoStructured Mater. 11 (3), 343 (1999).Google Scholar
4. Schmickler, W., Interfacial Electrochemistry (Oxford University Press, New York, 1996) p.129.Google Scholar
5. Ahmed, Z., Synthesis and Deformation of Nanocrystalline Nickel, M. S. Thesis (2000).Google Scholar
6. Bakonyi, I., Tóth-Kádár, E., Pogány, L., Cziráki, A., Gerocs, I., Varga-Josepovits, K., Arnold, B., Wetzig, K., Surface and Coatings Tech. 78,124 (1996).Google Scholar
7. Tóth-Kádár, E., Bakonyi, I., Pogány, L., and Cziráki, A., Surface and Coatings Tech. 88, 57 (1996).Google Scholar
8. Weertman, J. R., Farkas, D., Hemker, K., Kung, H., Mayo, M., Mitra, R., and Swygenhoven, H. Van, MRS Bulletin. 24 (2), 48 (1999).Google Scholar
9. Ebrahimi, F., Zhai, Q., Kong, D., Mater. Sci. Eng. A255, 20 (1998).Google Scholar