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Diffusion-Controlled Decohesion Using a Cu-Sn Alloy as a Model System

Published online by Cambridge University Press:  25 February 2011

Dafni Bika  and
Charles J. McMahon Jr
Dafni Bika
Affiliation:
University of Pennsylvania, Department of Materials Science and Engineering, Philadelphia, PA
Charles J. McMahon Jr
Affiliation:
University of Pennsylvania, Department of Materials Science and Engineering, Philadelphia, PA
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Abstract

This research deals with a mode of brittle intergranular fracture in which a surface-adsorbed embrittling element is driven into a grain boundary as a result of the application of a tensile stress across the boundary. A Cu-8%Sn alloy has been employed to explore this phenomenon, since tin is a surface-active element, and this alloy is known to suffer intergranular weakness at elevated temperatures. Intergranular cracking occurred by brittle, discontinuous crack advance at 265°C in vacuum with an average rate of 0.1μm/sec. This behavior is analogous to sulfur-induced stress-relief cracking in steels and several cases of liquid-metal embrittlement, suggesting that this phenomenon has a generic nature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 238: Symposium Cb – Structure and Properties of Interfaces in Materials , 1991 , 399
Copyright
Copyright © Materials Research Society 1992

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References

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