Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-28T21:48:44.287Z Has data issue: false hasContentIssue false

Development of In-Situ Surface Observation System with an Atomic Resolution under Tensile Stress by Atomic Force Microscope

Published online by Cambridge University Press:  11 February 2011

Akihito Matsumuro
Affiliation:
Department of Micro System Engineering, Nagoya University, Chikusa-ku, Nagoya 464–8603, Japan
Kimiharu Kayukawa
Affiliation:
Department of Micro System Engineering, Nagoya University, Chikusa-ku, Nagoya 464–8603, Japan
Youhei Fujimoto
Affiliation:
Department of Micro System Engineering, Nagoya University, Chikusa-ku, Nagoya 464–8603, Japan
Taeko Ando
Affiliation:
Department of Micro System Engineering, Nagoya University, Chikusa-ku, Nagoya 464–8603, Japan
Kazuo Sato
Affiliation:
Department of Micro System Engineering, Nagoya University, Chikusa-ku, Nagoya 464–8603, Japan
Get access

Abstract

A new in-situ surface observation system under tensile stress with an atomic resolution has been developed for the purpose of the explanation of the deformation of the surface and the crack growth mechanism for thin films in the micro- and nano-mechanical systems. The mechanical properties such as Young's modulus can be determined at the same time. This observation system consists of the on-chip tensile testing system and a commercialized atomic force microscope (AFM). The on-chip testing system is characterized by a static loading mechanism with a flat spring and a test chip of single-crystal silicon of 15×15×0.5 mm. Particular attention has been paid to the suppression of the vibration which effects on images of the surface with an atomic resolution. Atomic images of the surface of mica can be observed under various tensile strains till the occurrence of the fracture. The growth of the cracks and Young's modulus for TiN thin film deposited on silicon (100) specimen can be also clarified.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Komai, K., Minoshima, K. and Miyawaki, T., J. De Phys. IV, 6, 413 (1996).Google Scholar
2. Guan, J., Wang, C., Chu, W., Scripta Mater., 39, 1211(1998).Google Scholar
3. Sato, K., Shikida, M., Yamasaki, M., Yoshioka, T., Proc. MEMS'96, San Diego, 360(1996).Google Scholar
4. Hayashi, T., Matsumuro, A., Muramatsu, M., Takahashi, Y., Yamaguchi, K., Thin Solid Films, 349, 199(1999).Google Scholar
5. Srolovitz, D. J., Acta Metall., 37, 621 (1989).Google Scholar