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Deposition of Bronze Microwires on Ultrananocrystalline Diamond (UNCD) Electrodes

Published online by Cambridge University Press:  13 February 2012

Corina Grodek
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Lori A. Lepak
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Anirudha V. Sumant
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Ralu Divan
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Orlando Auciello
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439, USA
Daniel Rosenmann
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Suzanne Miller
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Ephriam Daniels
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Michael P. Zach
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
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Abstract

As technology advances, ever smaller wires are needed for devices, for applications in electronics, medicine, and clean energy. Many of these applications will require the precise control of not only wire shapes and diameters, but alloy compositions as well. The recently developed technique of Electroplate-and-Lift (E&L) Lithography developed by our group has demonstrated the capability of quickly and easily producing patterned micro- and nanowires of a large variety of electrodeposited materials. Here we report the first E&L- based synthesis of microwires with controlled alloy compositions, in the model system of bronze.

Wires of several different compositions, ranging from 100% copper to 100% tin, were deposited on patterned ultrananocrystalline diamond (UNCD)TM templates, by varying the relative concentrations of copper and tin salts in the plating solution. All wires were deposited at 55oC, -1.0 V vs. the saturated calomel electrode (SCE). Wire morphology and elemental composition was observed with scanning electron microscopy (SEM) equipped with energy-dispersive spectroscopy (EDS). For some alloy compositions, wires were interrupted at irregular intervals by nodules. All alloy wires were highly enriched in copper relative to the solution composition.

Type
Research Article
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

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