Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-12-01T03:13:22.251Z Has data issue: false hasContentIssue false
  • English
  • Français

Template Fabrication Challenges for Patterned Media

Published online by Cambridge University Press:  01 February 2011

Douglas Resnick ,
Gerard Schmid ,
Mike Miller ,
Gary Doyle ,
Chris Jones  and
Dwayne LaBrake
Douglas Resnick
Affiliation:
[email protected], Molecular Imprints, Inc., Strategic Development, 1807C West Braker Lane, Austin, TX, 78758, United States, 5126327375, 5123393799
Gerard Schmid
Affiliation:
[email protected], Molecular Imprints, Inc., 1807C West Braker Lane, Austin, TX, 78758, United States
Mike Miller
Affiliation:
[email protected], Molecular Imprints, Inc., 1807C West Braker Lane, Austin, TX, 78758, United States
Gary Doyle
Affiliation:
[email protected], Molecular Imprints, Inc., 1807C West Braker Lane, Austin, TX, 78758, United States
Chris Jones
Affiliation:
[email protected], Molecular Imprints, Inc., 1807C West Braker Lane, Austin, TX, 78758, United States
Dwayne LaBrake
Affiliation:
[email protected], Molecular Imprints, Inc., 1807C West Braker Lane, Austin, TX, 78758, United States
Get access

Abstract

The Step and Flash Imprint Lithography (S-FILTM) process uses field-to-field drop dispensing of UV curable liquids for step and repeat patterning for applications where high-resolution mix-and-match overlay is desired. Several applications, including patterned media, photonic crystals and wire grid polarizers, are better served by a patterning process that prints the full wafer since alignment requirements are not so stringent. In this paper, a methodology for creating high resolution thin templates for full wafer (or disk) imprinting is described. The methods have been applied toward the imprinting of both patterned media and photonic crystal devices using a large area printing tool developed around the S-FIL process. Techniques for further enhancing the pattern density as well as a method for addressing feature image placement are described. Finally, a process for replicating a Master Template is discussed in detail.

Keywords

lithography (deposition)deviceslithography (removal)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 961: Symposium O – Nanostructured and Patterned Materials for Information Storage , 2006 , 0961-O02-03
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Colburn, M., Johnson, S., Stewart, M., Damle, S., Bailey, T., Choi, B., Wedlake, M., Michaelson, T., Sreenivasan, S. V., Ekerdt, J., and Willson, C. G., Proc. SPIE, Emerging Lithographic Technologies III, 379 (1999).Google Scholar
2. Bailey, T. C., Resnick, D. J., Mancini, D., Nordquist, K. J., Dauksher, W. J., Ainley, E., Talin, A., Gehoski, K., Baker, J. H., Choi, B. J., Johnson, S., Colburn, M., Sreenivasan, S. V., Ekerdt, J. G., and Willson, C. G., Microelectronic Engineering 61–62 (2002) 461–467.Google Scholar
3. Dauksher, W. J., Nordquist, K. J., Mancini, D., Resnick, D. J., Baker, J. H., Hooper, A. E., Talin, A. A., Bailey, T. C., Lemonds, A. M., Sreenivasan, S. V., Ekerdt, J. G., and Willson, C. G., J. Vac. Sci. Technol. B 20(6), 2002, 2857–2861.10.1116/1.1520575Google Scholar
4. Hua, F., Sun, Y., Gaur, A., Meitl, M. A., Bilhaut, L., Rotkina, L., Wang, J., Geil, P., Shim, M., Rogers, J. A., A, Shim, Nano Lett.; 2004; 4(12) pp 2467–2471.10.1021/nl048355uGoogle Scholar
5. Schmid, G. M., Resnick, D. J., Thompson, E. D., Myron, L. J., Olynick, D. L., Liddle, J. A., Jones, G. A. C., Dauksher, W., Le, N., presented at the International Symposium on Electron, Ion, and Photon Beam Technology, and Nanobfabrication, June 2006.Google Scholar
6. Colburn, M., Bailey, T., Choi, B. J., Ekerdt, J. G., Sreenivasan, S. V., Solid State Technology,67, June 2001.Google Scholar
7. Schmid, G. M., Thompson, E., Stacey, N., Resnick, D. J., Olynick, D. L., Anderson, E. H.' to be published in Microelectronic Engineering 2007.Google Scholar
8. Hu, W., Sarveswaran, K., Lieberman, M., Bernstein, G. H., J. Vac. Sci. Technol. B 22, 4, Jul/Aug 2004.Google Scholar
9. Namatsu, H., Yamaguchi, T., Nagase, M., Yamazaki, K., and Kurihara, K., Microelectronic Eng., 41/42 (1998) pp. 331–334.10.1016/S0167-9317(98)00076-8Google Scholar
10. Moon, E. E., Everett, P. N., Smith, H. I., to be published in J. Vac. Sci. Technol. B, Nov./Dec., 2006 Google Scholar
11. Moon, E. E., Mondol, M. K., Everett, P. N., and Smith, H. I., J. Vac. Sci. Technol. B, 23, 749 (2005).Google Scholar
12. Miller, M., Schmid, G., Doyle, G., Thompson, E., Resnick, D. J., be published in Microelectronic Engineering 2007.Google Scholar
13. Miller, M., Doyle, G., Stacey, N., Xu, F., Sreenivasan, S.V., Watts and, M., LaBrake, D. L., Proc. SPIE 5751, 994 (2005).Google Scholar